W25Q64 Chip Write Socket Flip Cover Flash Reader Write Clear BGA24 Test Socket
Features: The BGA24 chip with a spacing of 1.0mm is suitable for two types of pin matrices (6x8MM): 6x4 and 5x5,
requiring different limit boxes. Before taking a photo, measure the chip size;
Using a Ushaped ejector pin for more stable contact (see diagrambelow);
The housing of theseat is special engineering plastic, which has strength and long service life;
The shrapnel is imported berylliumcopper material, with low impedances and good elasticity;
Thickened plating layer, thickened electroplating of contacts, low contact impedances, reliability;

Specifications: 1. Material
(1) InsulatorPEI, andPPS
(2) Shrapnel, Be Cu plating (30) μ)
Over Nickel Plating (50 μ)
2. Electrical characteristics
(1) Insulation resistance: 1000mΩMin, At DC500V
(2) Voltage withstand 700AC
(3) Contact impedances less than 25mΩ
(4) PIN pin elasticity 55g/PIN (Normal)
(5) Mechanical life 100000Times
(6) Working temperature: -65 ℃~155 ℃
Size：Mixed

Package Includes: 1PC BGA24 to DIP8 IC Socket

note: Due to manual measurement, please allow an error of 0-1cm. Please make sure you do not mind before bidding.
Due to the difference of different monitors, the picture may not reflect the actual color of the item. Thanks!