- 10DOF modules (three-axis gyroscope + triaxial accelerometer + three-axis magnetic field + Pressure)
- Immersion Gold PCB process
- Using the chip: MPU6050 + HMC5883L + BMP180
- Power supply :3-5v
- Means of communication: IIC communication protocol (fully compatible with 3-5v system containing LLC circuit)
- Size: 2.2cm * 1.7cm
- 10DOF modules (three-axis gyroscope + triaxial accelerometer + three-axis magnetic field + Pressure)
- Immersion Gold PCB process
- Using the chip: MPU6050 + HMC5883L + BMP180
- Power supply :3-5v
- Means of communication: IIC communication protocol (fully compatible with 3-5v system containing LLC circuit)
- Size: 2.2cm * 1.7cm
