Description
Polysynthetic silver thermal compound paste maximizes thermal conductivity between the CPU and heat sink/fan assembly.
Features and Specifications
Weight: 20g/tube
Operation Temperature: -50/180°c
Thermal Conductivity: >3.17W/m.k
Thermal Resistance: <0.067°c-in2/w
20% metal oxide compounds
INCLUDED - 2 X 20Gram Heatsink Compound Paste Syringe INCLUDED ( TOTAL 40Grams )