Feature:

1. Superfine silver wire,phone motherboard soldering precise connection copper wire.
2. Suitable for PCB BGA sodering point, for fingerprint mainboard chip repair.
3. 0.009mm Diameter and 200m / 656.2ft length, durable and tensile for motherboard fingerprint repair.
4. Non‑insulating type, small and easy to straighten wire, precise connection, avoid short circuit solder joint.
5. No need to remove the lacquer,welding directly. The wire is made of pure copper, and the is conductive.


Specification:

Item Type: Wire
Material: Copper
Color: Silver
Diameter: Approx. 0.009mm
Length: Approx. 200m / 656.2ft
Used for PCB BGA solder joint, mobile phone fingerprint motherboard chip maintenance


Package List:

1 x Wire
  



 

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