RELIFE RL-601T Middle Layer Tin Planting Platform Set , 22 in 1 Mid-tier Motherboard Repair Fixture Set for IP X-15 all series

PRODUCT CHARACTERISTIC:

1.Real Machine Detection,To Ensure Accuracy
The real machine is measured to ensure accuracy. Each detail, hole position and mesh is proofread according to the original drawings to ensure that every solder joint cannot be missing.

2.Unlimited Expansion Universal Base
Universal base, unlimited compatibility, continuous model update,
unlimited stacking without changing the base, One-time purchase, long-lasting use

3.Super Magnetic
Built-in three high-temperature strong magnets, strong magnetic adsorption, precise positioning,no offset, high temperature magnetism

4.Precise Positioning
Comes with precise positioning, it is more convenient to align the holes

5.22 In 1 middle layer tin planting

for IP X/XS/XS Max/11/11Pro/11 Pro Max/12/12Mini/12Pro/12 Pro Max/
13/13Mini/13Pro/13 Pro Max/14/14 Plus/14Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max

Tin Planting Steps:
1. Clean the middle pad with solder-absorbing tape
2. Place the tin planting net of the same motherboard model
3. Scrape the tin paste and clean the mesh surface
4. Slowly remove the entire stencil
Mesh without tin paste residue
5. Turn on the air gun to the appropriate temperatureand wind speed for middle layer heating.