RL-400/401/402/403 medium temperature solder paste 183℃ no-clean mobile phone repair solder paste welding tin mud

1.Paste delicate，Lasting shine，The particle size is only 20-38 micron.
RELIFE No. 4 solder matarial
Fine particles, evenly distributed

2.The paste is delicate, moderately moist, and the yield rate of tin implantation is high.

Continuous tin planting takes a long time,
There is basically no collapse after several hours of tin implantation.
The viscosity change is small and chip components are not prone to offset.

3.Moderate viscosity, no slumping or deflection

RELIFE solder paste has moderate humidity and is not easy to clump.
Easy to tin, no false soldering

3.Craftsmanship and quality
The solder joints are bright and full
No false welding, less residue, bright solder joints
Strong tin creep, good conductivity, oxidation resistance, no corrosion to PCB, no cleaning required

4.Applicable: PCB welding of dense pin IC and various high-demand materials
Features: Strong solder penetration, smooth and bright solder joints

5.Suitable for sensors, wires, motors, fuses, connectors, metal shells, lighting
Electronic components, SMT repair, BGA chip tin implantation, SMT patches, etc.