Thermal Grizzly's Minus Pad series features highly elastic and flexible thermal pads with exceptional conductivity that fill even the smallest gaps between components, made from a ceramic silicon formula complex and nano aluminum oxide for optimal and constant heat transfer with minimal pressure.
The Thermal Grizzly Minus Pad has a thermal conductivity of 8.0 W/mk and a temperature range of -100 °C to +250 °C. It is perfect for configurations that support extremely demanding applications. Simultaneously protects the contact surfaces and prevents the formation of microcracks.
The Thermal Grizzly Minus Pad 8 is best suited for electrical components such as PCs, notebooks, LED or LCD devices, semiconductors or transformers. For OC in particular, it is also used for CPUs, memory modules, GPUs, graphics card memories or motherboard chipsets. In general, it can be used for any component that uses a metal case as a heat sink.
as well as in the thicknesses of 0.5mm, 1mm, 1.5mm, 2.0mm
minus pad 8minus pad 8 - 30mm x 30mm x 2.0mm | BagAn airtight sealable and reusable package |