- Stencil Reballing template to reball Chip. - Qianli alloy module resistant to the impact of high temperatures or drying that occurs with a hot season. - Ideal for application in micro-soldering and work with the iPhone 5S BGA module. - Designed with fixing guides for IC Chip that ensure greater precision and an optimal result in the final work.
You have 4 business days to make the payment.
Please contact us if there is a delay in making payment.
If after that period we have not received payment, we reserve the right to make appropriate claims to eBay.
Our goal is to maintain the best service at the best price.
The return guarantee is specified in the lower part of the advertisement subject to the conditions of sale of our website.
Do not hesitate to contact us with any questions o
