With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Available at Arctic Silver resellers worldwide. Arctic Silver 5 is the reference premium thermal compound.
Arctic Silver 5 is optimized for a wide range of bond lines between modern
high-power CPUs and
high performance heatsinks or water-cooling
solutions.
Made With 99.9% Pure Silver:
Arctic Silver 5 uses three unique shapes and sizes of pure silver
particles to maximize particle-to-particle contact area and
thermal
transfer.
Controlled Triple-Phase Viscosity:
Arctic Silver 5 does not contain any silicone. The suspension fluid
is a proprietary mixture of advanced polysynthetic oils that work
together to provide three distinctive functional phases. As it comes
from the tube, Arctic Silver 5's consistency is engineered for easy
application. During the CPU's initial use, the compound thins out
to enhance the filling of the microscopic valleys and ensure the
best physical contact between the heatsink and the CPU core. Then
the compound thickens slightly over the next 50 to 200 hours of
use to its final consistency designed for long-term stability.
(This should not be confused with conventional
phase change pads that are pre-attached to many heatsinks. Those
pads melt each time they get hot then re-solidify when they cool.
The viscosity changes that Arctic Silver 5 goes through are much
more subtle and ultimately much more effective.)
Not Electrically Conductive:
Arctic Silver 5 was formulated to conduct heat,
not electricity.
(While much safer than electrically conductive silver and copper
greases, Arctic Silver 5 should be kept away from electrical traces,
pins, and leads. While it is not electrically conductive, the compound
is very slightly capacitive and could potentially cause problems
if it bridges two close-proximity electrical paths.)
Absolute Stability:
Arctic Silver 5 will not separate, run, migrate,
or bleed.
Compliance:
RoHS Compliant.
Thermal Conductance:
>350,000W/m2 °C (0.001 inch layer)
Thermal Resistance:
<0.0045°C-in2/Watt (0.001 inch layer)
Average Particle Size:
<0.49 microns <0.000020 inch
Extended Temperature Limits:
Peak: –50°C to >180°C Long-Term: –50°C to 130°C
Performance:
3
to 12 degrees centigrade lower CPU full load core temperatures than
standard thermal compounds or thermal pads when measured with a
calibrated thermal diode embedded in the CPU core.
Coverage Area: