The new IBM Distributed Power Interconnect (DPI) is a cost-effective solution for xSeries customers looking for an efficient power distribution product for the rack environment. This high-density PDU is ideal for extending and enhancing the levels of availability while supporting even the most power-demanding servers. While primarily designed for xSeries servers,it also supports mid-range and high-end server products. It is a rack-based product that can:speed installation;save money;decrease amount of cabling required;increase solution management.



Main Specifications
Product Description IBM Distributed Power Interconnect - power distribution unit
Device Type Power distribution unit
Input Voltage AC 250 V
Output Connector(s) Power IEC 309
Designed For eServer xSeries 226;306m;336;460;eServer xSeries MXE 460;System x3620 M3;x3850;x3950;x3950 E


Extended Specification
General
Device Type Power distribution unit
Power Device
Input Voltage AC 250 V
Power Output Connectors Details Power IEC 309
Max Electric Current 32 A
Compatibility Information
Designed ForIBM eServer xSeries 226 8488,8648 
IBM eServer xSeries 306m 
IBM eServer xSeries 336 8837 
IBM eServer xSeries 460 8872 
IBM eServer xSeries MXE 460 8874 
Lenovo Storage DX8200C 5120 
Lenovo System x3620 M3 
Lenovo System x3850 8863 
Lenovo System x3950 8872 
Lenovo System x3950 E 8874,8874 Datacenter High Availability with WS2003 Datacenter 32-bit 4-way COA,8874 Datacenter High Availability with WS2003 Datacenter 64-bit 4-way COA,8874 Datacenter Scalable Model,8879