REGENI BK-M400F
BGA rework station
Voltage and Power: AC220V, 60Hz, 2500 Watt
(If customers in US, Canada consider this item,
please use transformer, transformer is not included.)
Product size: 420 x 440 x 580mm(height)
Product weight: About 30Kgs
Upper heater/ Lower heater: hot air by fan type / ( 1200 watt x 2pcs, Total 2400watt)
Grand total power: 2500 Watt
PID temperature control
Vacuum pencil at side: 64Kpa, 7LPM
Thermocouple : K type
Max PCB size : 250 x 250mm
Automatic pick up desoldered chip by vacuum
Ball Grid Array chips (CPU, Memory chip) metal and plastic mold parts ,shield can,
etc on PCB to desolder and solder, reheating.
Various changeable magnet type nozzles are included and usable according to target part
PCB holding blocks are included.
Automatic going down of Upper heater without turning knob
Height of lower heater can be adjusted
Please select suitable Nozzle size according to target chip size.
(10x10, 13x13, 15x15, 18x18, 20x20, 24x24, 28x28 etc nozzles are included.)
Please set distance from bottom line of Nozzle attached on upper heater away from target part on PCB to : about 5mm
manually by turning knob
From top/bottom heater to flow hot air by built-in fan to desolder or solder target chip.
Manual dressing ( user has to use soldering iron and solder wick to do 1st cleaning on PCB pad,
and use Isoprophyl alcohol and cotton swab to remove contamination on PCB pad as 2nd cleaning,
and manually apply flux (gel type recommended flux : Alpha UP-78) and manually use brush to apply
suitable amount of flux. -- (Except for brush, any tools are not included. Option items)
You will require soldering iron, solder wick, isoprophyl alcohol and alcohol container
Place new part or reballed BGA chip on PCB pad. (About reballing tool, additionally ask us )
Click start button to start heating - cooling ( Fan automatically activate after heating finishes)
Alarm activates close to end of heating for user to turn upper heater knob and click suction to
use vacuum suction pencil to manually pick up targeted part.
Real time computerized temperature curve for upper heater and lower heater, and if sensor is connected,
sensor temperature can be checked to find comparison of actual heating temperature,
About 10 degrees or so tolerance can be accepted by sensitive feature of thermocouple against distance.
Real time temperature curve by time and its stablity shows how good this machine is.
(Linear curve by upper heater shows fast response by instruction of time, temperature change )
*We basically save 5 temperature profiles for user to change a little and adapt it for his chip to desolder or solder.
For example, 110-210-250 temperature profile, if part is melt on wasted PCB for test,
user decrease temperature of -5 like 110-205-245, test whether it melts,
also decrease time from 1st stage heating time 3sec- 2nd: 80sec- 3rd: 50sec -> 1st: 3 sec- 2nd: 75 sec- 3rd: 45 sec,
*Try to change 5 degrees higher or lower, 5 seconds longer or shorter to trace optimum profile
to apply lower temperature and shorter time if possible.
*Like other BGA machine, user should refer to reflow data of each chip or our reference save profiles to
change it a little to test your various chip and PCB.
*If chip is glued with epoxy etc chemical, please use sharp and strong ESD preventive tweezers
and at final stage before end of heating, check in advance rest time by watching count down time,
turn the knob to lift upper heater and push target chip very hard with sharp tweezers to detach .
*Caution: At final stage, other parts are also in melt condition.
Please do not try to touch other surrounding parts except for target chip.
Interface basically is in English.
There are 3 parameter changes mainly for upper heater and lower heater
For upper heater
Target temperature
Speed level of temperature increase
Staying time at target temperature
For lower heater
set the same 200, 210 or 220 for 2nd and 3rd stage.
1st, 2nd step is preheating as preparance stage,
do not set high temperature for a short time.
This is to avoid thermal shock.
Preheating stage
At our saved program, preheating stages are just heating before melting solder.
3rd step like 230~270 degrees actually melt solder with time together with Flux if required.
There are many things to share to well utilize Rework station
like height adjustment - about 5mm away from target for top nozzle and lower nozzle
changing suitable nozzle size : A little larger than chip size, for lower nozzle larger size should be attached than upper nozzle.
Exam) Top nozzle 18 , Lower nozzle 26 or 30 etc
covering adjacent chips with L shape heat sink to protect other chips
(Metal plate bent to cover other chips surrounding target chip)
Considering PCB size and shape, well mount PCB on our PCB holder
When chip is soldered, to well melt the whole solder balls on BGA chip,
you should apply just suitable amount of flux to prevent chip away from circuit of PCB.
Also adopted temperature profile is a little or rather higher than profile to melt chips,
thus you may require L shaped heat sink plate to protect other components around target BGA chip.
Because this machine does not have any VISION system by cheap cost,
User should place new reballed chip or new chip by direction and precise position by tweezers.
If you require VISION system, please separately ask us for our other machine BK-I510 or latest VISION rework system.