DH-B1 BGA REWORK STATION HOT AIR  & INFRARED 4800W 3X independent heating areas 220V

Don't support 110V

Fast shipping DHL  / Fedex

• New

• 2020 the latest version，Upgrade to 5200W, add Top heater wind regulation function

• For  Notebook/PS3 BGA Rework Station

• Specification：

  ower supply	220     50/60Hz
  Power	4800W
  Top heater	800W
  Bottom heater	2nd heater 1200W, 3rd infrared heater 2700W
  Lighting	Taiwan LED working light, any angle adjusted
  Operation model	Industrial PC with HD touch screen, intelligent conversational interface
  Storage	5000 groups of temperature profile
  Top head movement	Right/left , forward/backward , rotate freely.
  Positioning	PCB can be adjusted in X, Y direction with "5 points supporter" + V-groove PCB bracket + universal fixtures
  Temperature controll	K-type, cloosed loop
  Temperature accuracy	±2℃
  PCB size	Min 22*22mm  ,  Max 390*440mm
  BGA chip available	Min 2*2mm , Max 80*80mm
  Minium chip spacing	0.15mm
  Dimension	610*620*560mm
  Net weight	45kg

   

  　

• 1.Embedded Industrial PC, high definition touch screen interface, PLC control, and instant profile analysis function. Real-time settings and actual temperature profile display can be used to analyzed and correct parameters if necessary.
  2.It uses precise K-type close circuit control and automatic temperature adjustment system, with PLC and temperature module to enable precision temperature control of ±2 ℃. External temperature sensor enables temperature monitoring and accurate analysis of real time temperature profile.
  3.V-groove PCB support for rapid, convenience and accurate positioning that fits for all kinds of PCB board.
  4.Flexible and convenient removable fixture on the PCB board which protects and prevent damage to PCB. It can also adapt to rework various BGA packages.
  5.Various sizes of BGA nozzles, which can be adjusted 360 degree for easy installation and replacement;
  6.Three temperature areas can independently heat and are multiple controllable and adjustable to ensure best integration of different temperature areas. Heating temperature, time, angle, cooling and vacuuming can all be set on the interface.
  7.There are 6-8 levels of variable and constant temperature controls. Massive storage of temperature curves which are Instant accessible according to different BGA. Curve analysis, setting and adjustment are all accessible via touch screen. Three heating areas adopts independent PID calculation to control heating process to enable more accurate and precise temperature control
  8.accurate and precise temperature control
  9.It uses high powered blower to enable fast cooling of PCB board and prevent it from deformation. There are also internal vacuum pump and external vacuum pen to assist with fetching the BGA chip.
  10.Including Voice "early warning" function. 5-10 seconds before the completion of uninstalling or welding, voice reminder / warning to get the workers prepared. Cooling system will start after vertical wind stopped heating. When the temperature drops to room temperature, the cooling process will stop, so that the machine will not age after heated up.
  11.External USB interface, convenient for uploading and storing current curve. Available for computer mouse
  12.CE certification, with emergency switch and automatic power-off protection device when emergency happens

  Operations:
  1、Preheat Preheat the PCB board and BGA chip, and the temperature of constant temperature oven is set at 80 ℃ -100 ℃, for 4-8 hours to remove internal moisture of the PCB and BGA, to prevent the burst phenomenon when heating. 2、Remove Place the PCB board into the bracket on the repair station,and select the appropriate hot air reflow nozzle,and set the appropriate soldering curve,press the open button until it finishes,and then move the hot air manually,to suck the BGA chip away with the vacuum suction pen. 3、Clean-up welding The BGA pad clean-up , one with de-soldering line to drag flat, the second with iron; Best to remove the tin a short time after the BGA removed , then BGA has not completely cooled , and the temperature difference make less damage to the pad;use the flux can improve the activity of soldering tin,better to clean the soldering tin. Particular attention not to damage the PCB pad,and in order to ensure the reliability of BGA solder, when the cleaning pad to make use of some of the solder paste residues with more volatile solvents , such as plate washer water, industrial alcohol. 4、BGA re-balling Wipe the paste flux equably with the brush pen on the BGA pad, choose the right steel mesh, and then plant tin beads by the re-balling kit on the right pad.
  5、BGA tin beads welding Heat the bottom heating zone of BGA re-balling station and then weld the tin beads on the pad.
  6、Besmear flux
  Wipe the paste flux with the brush pen on the PCB pad. If you wipe so much, it will cause connected welding, on the contrary, it will cause null welding. In order to wipe off dust and impurity of tin balls, and enhance welding effect, the welding paste must be wiped equally. 7、Place the BGA chip Place the BGA chip on the PCB board with manual alignment and silk-screen borders, meanwhile the tension of the solder joint when melt will have a good self- alignment effect. 8、Weld First, put the PCB board which is pasted with BGA chip on the positioning stand, and then move the hot wind head to the working place. Second, choose the appropriate backflow nozzle and set right welding temperature curve, start heating, open the switch, and then run the welding process. Besides, after the welding process is finished, you have to cool the BGA by the cooling fan. Hoist the upper hot wind head and make the bottom of hot wind nozzle apart from the surface of BGA 3-5mm, and stay 30-40 seconds, or, you can move the hot wind head after the starting switch is put out, withdraw the hot wind head.Finally, take away the PCB board from the heating zones.
  (1) null welding： Because of counterpoint by hand will cause deviation between chip and welding plate, surface tension of tin ball will make BGA chip and welding plate in the process of automatic correction. Once heating, BGA falls not evenly, which cause the chip drops not evenly.If stop reflowing at this time, the chip will not fall normally,which will cause the phenomenon of empty welding and false welding.So you need to extent time of third 、forth temperature zones or add the bottom pre-heating temperature to make ,the tin balls meltdown and drop evenly.
  8
  (2) short circuit： When the ball reached the melting point,it is in a liquid state , if too long or too high temperature and pressure,it will destroy surface tension of solder balls and the supporting role, resulting in short-circuit phenomenon when reflows,the chips fall entirely on the PCB pads the , so we need to appropriately reduce the heating section of the third and fourth soldering temperature and time , or reduce the bottom of the preheat temperature.

  
  
  
  

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What in  Package:

1. 1 x  DH-B1 BGA 3X independent heating  areas Kit