Soldering Flux RMA 39i has a base of high-purity rosin with the equivalent activation of RMA (Rosin Mildly Active) to clear oxidants from the surface of the circuit in preparation for good fusion.

About:

• designed for "no-clean" technology. After fusion, very low level of residue remaining may be left without risk of corrosion.
• after de-soldering, apply RMA 39i to the PCB, spread thinly, position the new component, and reheat locally
• Bono Test (Sagem/Schneider): No corrosion after 15 days under 20V and 100Vdc 85ºC/85%RH
• Use in a well ventilated area away from ignition source. Risk Classification R42/43.
• Production date: 07.2023 (Good for minimum 12 month in ideal storage conditions)
• Ideal storage conditions - in original sealed container at 6-10ºC.