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About this item

  • A base engineered to minimize CPU contact gaps provides excellent heat conduction.
  • Product Dimension 5.4 x 4.8 x 2.3 inches
  • Suitable for limited space applications (e.g. HTPC or slim systems).
  • Newly developed thin fan profile delivers uncompromised cooling performance in a compact package.
  • Unique heatpipe layout combines two very effective cooling methods to increase efficiency while maintaining a low profile heatsink.
  • Supports Intel sockets LGA 2011/1366/1155/1156/775 and AMD sockets FM1/FM2/AM3+