General information
Type	CPU / Microprocessor
Market segment	Mobile
Family	AMD Phenom II Dual-Core Mobile
Model number  ?	P650
CPU part number	HMP650SGR23GM is an OEM/tray microprocessor
Stepping code	NAEKC AE
Frequency  ?	2600 MHz
Bus speed  ?	One 1800 MHz 16-bit HyperTransport link (3.6 GT/s)
Clock multiplier  ?	13
Package	638-pin lidless organic micro Pin Grid Array (UOL638)
AMD Package number	30600
Socket	Socket S1 (S1g4)
Size	1.38" x 1.38" / 3.5cm x 3.5cm
Weight	0.2oz / 6.5g (by specifications)
Introduction date	September - October 2010
End-of-Life date	Last order date is end of 3rd quarter 2011 Last shipment date is end of 1st quarter 2012
Architecture / Microarchitecture
Microarchitecture	K10
Platform	Danube
Processor core  ?	Champlain
Core stepping  ?	DA-C3
CPUID	100F63
Manufacturing process	0.045 micron silicon-on-insulator (SOI) technology
Data width	64 bit
The number of CPU cores	2
The number of threads	2
Floating Point Unit	Integrated, 128-bit wide
Level 1 cache size  ?	2 x 64 KB 2-way set associative instruction caches 2 x 64 KB 2-way set associative data caches
Level 2 cache size  ?	2 x 1 MB 16-way set associative caches
Level 3 cache size	None
Multiprocessing	Uniprocessor
Features	MMX instructions Extensions to MMX 3DNow! technology Extensions to 3DNow! SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSE4a  ?  AMD64 / AMD 64-bit technology  ?  EVP / Enhanced Virus Protection  ?  AMD-V / AMD Virtualization technology
Low power features	PowerNow!
Integrated peripherals / components
Integrated graphics	None
Memory controller	The number of controllers: 1 Memory channels: 2 Supported memory: DDR3-1066, DDR3L-1066 Maximum memory bandwidth (GB/s): 21.3
Other peripherals	HyperTransport technology 3.0
Electrical / Thermal parameters
Thermal Design Power  ?	25 Watt