Baseband Software
Chipset Supplier Qualcomm GSM/EDGE/WCDMA WCDMA PS: UL 384kbps/DL 384kbps
Chipset MDM9X07 OS Windows XP SP3
Windows Vista
Windows 7/8/8.1/10/IoT
MAC
Linux
MAC
Android
Processor Speed (Apps) 1.2GHz 3GPP release
LTE Rel 9
WCDMA Rel ‘99 plus Rel 5 HSDPA, Rel 6 HSUPA, Rel 7 HSPA+
USIM/SIM slot 3FF SIM
3V SIM card and 1.8V SIM card

HSDPA/

HSUPA/

HSPA+/LTE

HSDPA:  
               DL 14.4Mb/s(Category 10)
               DL 21Mb/s(Category 14)
               DL 42Mb/s(Category 24)
Memory(SDRAM/NAND) 128MBytes/256MBytes HSUPA:
               UL 5.76Mb/s(Category 6)
MICRO SD slot Micro SDHC, 2G~32GByte Capacity, SD 2.0 Class 6 LTE FDD: (Category 4):
               DL 150Mb/s
               UL 50Mb/s
USB Version USB 2.0 HIGH SPEED  LTE TDD(Category 4):
               DL 117Mb/s
               UL 9Mb/s
Interface USB
Power Supply 5V
LED Red: Turn on but not register
Green Blinking:  Register and connect to 2G/3G
Green Solid: Register to 2G/3G
Blue Blinking: Register and connect to 4G
Blue Solid: Register to 4G
Browser IE
RF Firefox
Safari
Chipset WTR2955 Opera
Band
FDD-LTE:B1/2/3/4/5/7/8/12&B17/20
UMTS:B1/2/4/5/8
GSM:850/900/1800/1900
Chrome
Receive Diversity Antenna Internal antenna GPRS class Class B
Application Approvals &Certification
RAS No RoHS Yes
RNDIS/ECM Yes, RNDIS for Windows and ECM for Mac/Linux CE,GCF Europe
Voice No FCC,PTCRB North America
Video Call No NCC Tai Wan
SMS Yes JRF,JPA Japan
MMS No KC South Korea
STK Optional ACMA Austrilia, New Zealand
USSD Optional IC Canada
Phonebook Yes others on customer's demand
Network Lock Optional Envionment
SIM Reader No
Language Yes, English by default Operating Temperature -20 to 60° C
IPv6 Yes Storage Temperature -40 to 70° C
Upgrade Yes, Support FOTA for driver free version Humidity 5%~ 95%
Applicable Area Application Scenarios
Global Cover America, Europe, Asia, Oceania, Africa,etc. and have deployed on scale Vertical Applications Telemedicine, UAV, Intelligent Manufacturing, Vehicle navigation, Logistics, Intelligent Agriculture;Can be customized with R&D level technique support.