Ideal for all of the CPU and VGA cooler

HY600 series are optimized for a wide range of bond lines between modern high-power CPUs and high performance heat-sinks or air-cooling solutions.




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30 days Free Retunes (all items returned should be Sealed NOT Opened Not Used and in its original packaging)



Electrically Non-conductive
Contains Silicone, Carbon & Metal Oxide Compounds 

Color
Gold

Thermal Conductivity
3.05W/m-K
Thermal Impedance
0.073°C- in2/W
Specific Gravity
2.48No
Evaporation
0.001%
Bleed
0.05%
Dielectric Constant
5.1No
Thixotropic Index
380+/-101/10mm
Moment Bored Temp.
-50~280°C
Operation Temperature
-30~240°C




Silicone Compounds
30%
Carbon Compounds
20%
Metal Oxide Compounds
50%