Ideal for all of the CPU and VGA cooler
HY600 series are optimized for a wide range of bond lines between modern high-power CPUs and high performance heat-sinks or air-cooling solutions.
Color | Gold | ||
Thermal Conductivity | 3.05 | W/m-K | |
Thermal Impedance | 0.073 | °C- in2/W | |
Specific Gravity | 2.48 | No | |
Evaporation | 0.001 | % | |
Bleed | 0.05 | % | |
Dielectric Constant | 5.1 | No | |
Thixotropic Index | 380+/-10 | 1/10mm | |
Moment Bored Temp. | -50~280 | °C | |
Operation Temperature | -30~240 | °C | |
Silicone Compounds | 30% | ||
Carbon Compounds | 20% | ||
Metal Oxide Compounds | 50% |