Solder Flux Paste Low Temperature Solder Paste Sn42/Bi58 138℃ 30/55g PCB BGA PGA
1.A high viscosity no-clean flux, widely used in PCB, BGA, PGA rework, computer and cell phone chip soldering and rebound.
2.A mixture of high quality alloy powder and resin paste flux to avoid yellowish residue and easy to clean circuit boards.
3. High joint strength and good immersion.
4. Unique formula, perfect performance, easy to weld, bright and full solder joints, no false soldering, fake soldering and so on.
5. Good insulation performance, smooth welding surface, good welding tool.
6.Features of solder paste No pollution, strong viscosity, bright solder joints.
Name: low temperature solder paste
Alloy: Sn42/Bi58 tin powder
Male wire: 25-45um
Melting point: 138°C
Packing: can/tube
Low temperature solder paste *1
1. Customer satisfaction is our top goal. We believe our items are so outstanding. All products are quality checked. They are new and in good condition when shipped to our customers. We are convinced you will be happy with your Purchase.
2. If product is defective or damage upon arrival, or wrong product shipped, please contact us immediately. Returns accepted within 30 days of delivery date and item must be in original new condition.
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If the item is defect when you receive it or you are not satisfied with it, please return it within 30 days for a replacement or money back. But the items must be back in factory condition. Please contact us and double check the return address before you return it.