A Kit is the PCB, micro SD slot and ceramic capacitor.
DIY means you need to solder the parts for yourself.
This is version 4.0 of the NAND-AID, see
https://github.com/V10lator/NAND-AID/releases/tag/v4.0 for KiCad and gerber files.
Changes to version 3.0:
- Changed GND hole to prevent a possible short.
- Made GND arm a tiny bit longer.
- Various optical design changes.
- Various small changes and fixes.
Changes to version 2.1:
- Bigger GND hole for way more simple soldering.
- Readded GND arm from NAND-AID version 1 but completely redesigned.
- Reduced VIAs to reduce the chance of a short.
- Thicker traces and more GND fill for better signal integrity.
- Bigger DSB pad.
- Various changes and fixes.
Production details:
- 0.6mm thick Shengyi S1000H.
- Lead-free HASL.
- Extra small VIA holes to reduce the chance of shorts to nearly zero.
FAQ:
Q: Why HASL and not ENIG?
A: Cause ENIG survives a single solder work only but to utilise the dumping pads (which are the only pads the type of finish matters anyway) you have to solder 2 times. So after you used the dumping pads there is no ENIG anymore anyway. Also costs would skyrocket in case of ENIG but I try to give you a good deal.
Q: Okay but why no hard gold?
A: Cause that would be way, way more expensive than ENIG and it doesn't bring benefits over HASL here. Hard gold is meaned for things which are under mechanical stress (like the connection between your PCs mainboard and the graphics card). It prevents the copper from rusting and is scratch resistant, so your graphics card won't rust away when you reconnect it to the motherboard a few times. The NAND-AID doesn't have such gold finger contacts, so HASL protects the copper from rust more than good enough.
Q: I see. But why no other modern finishing like OSP?
Cause they are all more expensive without bringing any benefits. OSP vaporises while soldering for example, so it's worse than ENIG.
Q: Why 0.6 mm?
A: Cause it's the best. See, on one hand you want the PCB to be as thin as possible to make soldering to the Wii Us mainboard more simple while on the other hand the micro SD slot has 0.6 mm legs. The PCB shouldn't be thinner than the legs or things won't align anymore.
Q: Why Shengyi S1000H and what does that even mean?
A: TG is the point (in ° C) at which this glas beginns to get softened. So you can heat the board up to around 150-160° C without it showing any sign of thermal stress like deforming.
Note that these 150-160° C are temperatur values for over longer time. So you can heat the board up for mintes or even hours to that and nothing will happen. It's not the maximum solder temperature, that's ofc. higher. So don't worry and just solder like you always do esp. after reading the next sentence:
Beside that TG 150-160 is industry standart. Your PCs mainboard, the one in your mobile phone and so on are all TG 150-160.
Shengyi S1000H is extea robust, lead free and RoHS conform TG 150-160, basically the best available on the market today.
Feel free to ask me any open questions before and/or after the purchase.