Product Description
General information | |
Type | CPU / Microprocessor |
Market segment | Desktop |
Family |
|
Model number ? |
i7-970
|
CPU part numbers |
|
Frequency ? | 3200 MHz |
Maximum turbo frequency |
3467 MHz (1 or 2 cores)
3333 MHz (3 cores or more)
|
Bus speed ? | 4.8 GT/s QPI (2400 MHz) |
Clock multiplier ? | 24 |
Package | 1366-land Flip-Chip Land Grid Array (FC-LGA10) |
Socket | Socket 1366 / B / LGA1366 |
Size | 1.77" x 1.67" / 4.5cm x 4.25cm |
Introduction date | July 18, 2010 |
End-of-Life date |
Last order date is January 27, 2012
Last shipment date is July 6, 2012
|
Price at introduction | $885 |
S-spec numbers | |
Architecture / Microarchitecture | |
Microarchitecture | Westmere |
Platform | 2010 HEDT |
Processor core ? | Gulftown |
Core stepping ? | B1 (SLBVF) |
Manufacturing process |
0.032 micron High-K metal gate process
1170 million transistors
|
Die | 239mm2 |
Data width | 64 bit |
The number of CPU cores | 6 |
The number of threads | 12 |
Floating Point Unit | Integrated |
Level 1 cache size ? |
6 x 32 KB 4-way set associative instruction caches
6 x 32 KB 8-way set associative data caches
|
Level 2 cache size ? | 6 x 256 KB 8-way set associative caches |
Level 3 cache size | 12 MB 16-way set associative shared cache |
Physical memory | 24 GB |
Multiprocessing | Uniprocessor |
Features |
|
Low power features | Enhanced SpeedStep technology ? |
Integrated peripherals / components | |
Integrated graphics | None |
Memory controller |
The number of controllers: 1
Memory channels: 3
Supported memory: DDR3-800, DDR3-1066
Maximum memory bandwidth (GB/s): 25.6
|
Other peripherals | Quick Path Interconnect (1 link) |
Electrical / Thermal parameters | |
V core ? | 0.8V - 1.375V |
Minimum/Maximum operating temperature ? | 5°C - 67.9°C |
Thermal Design Power ? | 130 Watt |
1 * CPU.
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