Introduction to Semiconductor Refrigeration Chip:
• Semiconductor refrigeration sheets are a type of heat pump.
• Its advantage is that there are no sliding components, which can be applied in situations where space is limited, reliability requirements are high, and there is no refrigerant pollution. Utilize the Peltier effect of semiconductor materials.
• When direct current is connected in series through two different semiconductor materials to form a couple, heat can be absorbed and released at both ends of the couple, achieving the purpose of refrigeration.
• It is a refrigeration technology that generates negative thermal resistance, characterized by no moving components and high reliability.
◊ The working state of the cold piece is that one side is cooling and the other is heating. The heating surface must be well dissipated during work. It is strictly forbidden to turn on the power for more than 5 seconds without heat dissipation.
◊ When installing the radiator, be sure to apply thermal grease.
◊ There are literals for cold noodles, and no literals for hot noodles.
◊ If you don't know the hot and cold side, you can use a 1.5V dry battery to test it. After a few seconds of power on, the hot side (without literal) will be hot, and the cold side (with literal) will be cold.
◊ A radiator or a water cooling device must be installed on the heat dissipation surface, otherwise it will burn.
Chip model: TEC1-12703
Dimensions: 40*40*4.3mm±0.1, the number of pairs of components is 127
Wire specifications: lead length 310mm±5mm, RV standard wire, 5mm tinned single end
Internal resistance: 4.0~4.3Ω (ambient temperature 23±1℃, 1 KHZ, AC test)
Maximum temperature difference: △Tmax (Qc=0) above 63℃
Working current: Imax=3A (when 15.5V starts)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax27W
Assembly pressure: 85N/cm2
Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)
Encapsulation process: standard 704 silicone rubber seal around
Chip model: TEC1-12704
Dimensions: 40*40*4.0mm, the number of pairs of components is 127
Wire specifications: lead length 300±5mm, RV standard wire, single end 5mm, tinned
Internal resistance: 3.0~3.3Ω (ambient temperature 23±1°C, 1KHZ, AC test)
Maximum temperature difference: △Tmax (Qc=0) above 63°C
Working current: lmax=4A (when 15.5V starts)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 36W
Assembly pressure: 85N/cm2
Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)
Encapsulation process: standard 704 silicone rubber seal around
Chip model: TEC1-12705
Dimensions: 40*40*3.8mm, the number of pairs of components is 127
Wire specifications: lead length 100±5mm, RV standard wire, single end 5mm, tinned
Internal resistance: 2.4~2.7Ω (ambient temperature 23±1°C, 1 KHZ, AC test)
Maximum temperature difference: △Tmax (QC=0) above 61°C
Working current: ImaX=5 (at 15.5V startup)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 30W
Assembly pressure: 85N/cm2
Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)
Encapsulation process: standard 704 silicone rubber seal around
Chip model: TEC1-12706
Dimensions: 40*40*3.7mm, the number of pairs of components is 127
Wire specifications: lead length 300±5mm, RV standard wire, single head 5mm, tinned
Internal resistance: 2.0~2.2Ω (ambient temperature 23±1°C, 1 KHZ, AC test)
Maximum temperature difference: △Tmax (Qc=0) above 62℃
Working current: Imax=6 (4.5A at rated voltage startup)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 60W
Assembly pressure: 85Ncm2
Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)
Encapsulation process: standard 704 silicone rubber seal around
Chip model: TEC1-12707
Dimensions: 40*40*3.6mm, the number of pairs of components is 127
Wire specifications: lead length 300±5mm, RV standard wire, 5mm tinned single end
Internal resistance: 1.8~2.0Ω (ambient temperature 23±1°C, 1 KHZ, AC test)
Maximum temperature difference: △Tmax (Qc=0) above 62°C
Working current: Imax=7A
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 67W
Assembly pressure: 85N/cm2
Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)
Encapsulation process: standard 704 silicone rubber seal around
Chip model: TEC1-12708
Dimensions: 40*40*3.5mm, the number of pairs of components is 127
Wire specifications: lead length 300±8mm, RV standard wire, 5mm tinned single end
Internal resistance: 1.5~1.7Ω (ambient temperature 23±1°C, 1 KHZ, AC test)
Maximum temperature difference: △Tmax (Qc=0) above 60°C
Working current: Imax=8A
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 77W
Assembly pressure: 85N/cm2
Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)
Encapsulation process: standard 704 silicone rubber seal around
Chip model: TEC1-12709
Dimensions: 40*40*3.5mm, the number of pairs of components is 127
Wire specifications: lead length 200±5mm, RV standard wire, 5mm tinned single end
Internal resistance: 1.3~1.5Ω (ambient temperature 23±1°C, 1 KHZ, AC test)
Maximum temperature difference: △Tmax (Qc=0) above 61°C
Working current: Imax=9A
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 85W
Assembly pressure: 85N/cm2
Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)
Encapsulation process: standard 704 silicone rubber seal around
Chip model: TEC1-12710
Dimensions: 40*40*3.4mm, the number of pairs of components is 127
Wire specifications: lead length 300±8mm, RV standard wire, 5mm tinned single end
Internal resistance: 1.2~1.3Ω (ambient temperature 23±1°C, 1 KHZ, AC test)
Maximum temperature difference: △Tmax (Qc=0) above 60°C
Working current: Imax=10A
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 85W
Assembly pressure: 85N/cm2
Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)
Encapsulation process: standard 704 silicone rubber seal around
Chip model: TEC1-12712
Dimensions: 40*40*3.3mm, the number of pairs of components is 127
Wire specifications: lead length 200±8mm, RV standard wire, 5mm tinned single end
Internal resistance: 1.0~1.1Ω (ambient temperature 23±1°C, 1 KHZ, AC test)
Maximum temperature difference: △Tmax (Qc=0) above 62°C
Working current: Imax=9.5A
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 114W
Assembly pressure: 85N/cm2
Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)
Encapsulation process: standard 704 silicone rubber seal around
Chip model: TEC1-19906
Dimensions: 40*40*4.2mm, 199 pairs of components
Wire specifications: lead length 155±8mm, soft silicone wire, single-ended 5mm tinned
Internal resistance: 3.0-3.2Ω (ambient temperature 23±1°C, 1 KHZ, AC test)
Maximum temperature difference: above 63°C
Maximum current: ImaX=6A
Maximum voltage: 24V
Assembly pressure: 85N/cm2
Maximum temperature resistance: 200°C. For normal cooling work, the heat dissipation surface needs to be controlled within 50 degrees
Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)
Encapsulation process: standard epoxy resin sealing around
Chip model: TEC1-12706 (high quality)
Dimensions: 40*40*4.0±0.1mm, the number of components is 127
Wire specifications: lead length 110±5mm
Internal resistance: 2.0~2.2Ω (ambient temperature 23±1°C, 1 KHZ AC test)
Maximum temperature difference: ≥65°C
Maximum current: 6A
Maximum voltage: 15.4V
Cooling power: 53.4W
Assembly pressure: 85Ncm2
Working environment: temperature range -50°C~80°C (excessive ambient temperature will directly affect cooling efficiency)
Encapsulation process: standard 704 silicone rubber seal around
12V semiconductor refrigeration sheet product introduction:
♥ Semiconductor coolers bring us a new concept of heat dissipation, so that the temperature of the CPU can be further controlled. With the advent of summer and the rise of ambient temperature, overclocking enthusiasts want to further improve the cooling conditions of the CPU. When the semiconductor cooler is powered on, there will be a certain temperature difference between the plates at both ends. The cooling surface provides a cool environment for the CPU.
♥ Semiconductor refrigerators have many uses, and can be used to make portable refrigerators/incubators, hot and cold water dispensers, etc. Also used for heat dissipation of electronic devices. At present, the semiconductor material used in the refrigerator is mainly bismuth telluride, and the impurity is added to form an N-type or P-type semiconductor temperature difference element after special treatment. Taking the common TEC1-12605 in the market as an example, its rated voltage is 2V, its rated current is 5A, its temperature difference can reach 60 degrees Celsius, its dimensions are 40X40X0.4cm, and its weight is about 25 grams. Its working characteristic is that one side is cooling and the other side is heating.
♥ After the DC power supply is turned on, the electrons start from the negative electrode (-), first pass through the P-type semiconductor, absorb heat here, and then release the heat when it reaches the N-type semiconductor. On the other side, a temperature difference is caused, thus forming a hot and cold end.
