Kester 24-6337-8801 • Free Shipping
"245" No-Clean Flux Solder will create visually acceptable assemblies without the need and expense of cleaning. Solderability and efficiency are comparable to that of mildly activated rosin flux (RMA). Residues are non-corrosive, non-conductive and do not require removal in most applications.
• Compatible metals: Platinum, gold, copper, tin, solder and silver.
Kester 63-37 #245 Product Performance
• Most common tin-lead eutectic used in pcb assembly applications
• Non-corrosive, non-conductive post-soldering residue
• Residues are kept to a minimum
• Most applications do not require residue removal
• Concorde-Electronics is an Authorized Kester Solder distributor
Kester Specifications:
• Kester 24-6337-8801
• Alloy: Sn63 / Pb37 (63% tin - 37% )
• Wire Diameter: .031"
• Core Flux: #245 No-Clean
• Core Size: 2.2% flux by volume ( 58 )
• Spool Size: 1 lb.
• Melting Range: 361º F (183º C)
• Classified as ROL0 per ANSI-J-STD-006C
• Per Federal Specification QQ-S-571e.
• Compliant to Bellcore GR-78