Type | CPU / Microprocessor |
Market segment | Desktop |
Family | AMD Phenom II X3 |
Model number ? | B75 |
CPU part number |
|
Stepping code | AACYC AC |
Frequency ? | 3000 MHz |
Bus speed ? | 667 MHz Memory controller One 2000 MHz 16-bit HyperTransport link (4 GT/s) |
Clock multiplier ? | 15 |
Package | 938-pin organic micro-PGA |
Sockets | Socket AM2+ Socket AM3 |
Weight | 1.4oz / 38.6g |
Architecture / Microarchitecture | |
Microarchitecture | K10 |
Platform | Dragon |
Processor core ? | Heka |
Core stepping ? | RB-C2 |
CPUID | 100F42 |
Manufacturing process | 0.045 micron silicon-on-insulator (SOI) technology |
Die size | 258mm2 |
Data width | 64 bit |
The number of CPU cores | 3 |
The number of threads | 3 |
Floating Point Unit | Integrated |
Level 1 cache size ? | 3 x 64 KB 2-way set associative instruction caches 3 x 64 KB 2-way set associative data caches |
Level 2 cache size ? | 3 x 512 KB 16-way set associative exclusive caches |
Level 3 cache size | Shared 6 MB 48-way set associative cache |
Cache latency [1] | 3 (L1 cache) 15 (L2 cache) 50 (L3 cache) |
Multiprocessing | Uniprocessor |
Features | |
Low power features | |
Integrated peripherals / components | |
Integrated graphics | None |
Memory controller | The number of controllers: 1 Memory channels: 2 Channel width (bits): 72 Supported memory: DDR2-1066, DDR3-1333 DIMMs per channel: up to 2 Maximum memory bandwidth (GB/s): 21.3 |
Other peripherals | HyperTransport 3 technology |
Electrical / Thermal parameters | |
V core ? | 0.8V - 1.425V |
Maximum operating temperature ? | 55°C - 73°C |
Thermal Design Power ? | 95 Watt |