Features:
1.A high viscosity no-clean flux, widely used in PCB, BGA, PGA rework, computer and cell phone chip soldering and rebound.
2.A mixture of high quality alloy powder and resin paste flux to avoid yellowish residue and easy to clean circuit boards.
3. High joint strength and good immersion.
4. Unique formula, perfect performance, easy to weld, bright and full solder joints, no false soldering, fake soldering and so on.
5. Good insulation performance, smooth welding surface, good welding tool.
6.Features of solder paste No pollution, strong viscosity, bright solder joints.
Product Parameters:
Name: low temperature solder paste
Alloy: Sn42/Bi58 tin powder
Male wire: 25-45um
Melting point: 138°C
Packing: can/tube
Packing list:
Low temperature solder paste *1