What you will get?

T-870At - 870 aChassis chassis

PCB Board holderPCB Board holder

Lamp Body and Lens(D=48mm)Lamp Body and Lens(D = 48mm)

Temp-sensor for IR-LampTemperature sensor for IR-Lamp

Temp-sensor for Pre-heat dishTemperature sensor for Pre-heat dish

Eye protection(IR Filter)Eye protection(IR Filter)

Cell guide

Focus holder

Focus holder control knob

Fasten nut for focus holder. Fasten nut

Steady ring

Fasten nut for steady ring

Power Cable (110VAC or 200VAC)Power Cable (110 vac or 200 vac)

5mm Fuse, 10A 250VAC(Spare)5mm Fuse, 10 250 vac(Spare)

CD User Manual w/Video User Manual w/Video CD
Product features.
1、The machine adopts self-developed infrared heating device, international advanced infrared desoldering technology.
2、Special infrared heating, strong penetration, uniform heating of the device, breaking through the traditional hot air desoldering machine cover the component heating, thermal shock greater shortcomings.
3、Easy to operate, after a day of training can fully operate this machine.
4、No need to desoldering jig, this machine can desoldering 35-50mm all components.
5、This machine is equipped with 800W preheating soluble system, preheating range 240x180mm.
6、Infrared heating without hot air flow, will not affect the surrounding micro components, can desoldering or rework BGA, SMD, CSP, LGA, QFP, PLCC and BGA implant ball, especially BGA, SMD components. Also can rework all kinds of row of plug strips and pin sockets (such as CPU sockets and GAP sockets).
7. Fully capable of meeting the BGA desoldering/reworking requirements of computers, notebooks, e-games, etc. Particularly suitable for computer north and south bridges.

 
                         Computer motherboard expansion slot, socket sample diagram
1、Check before powering on and turning on.
①, check the infrared lamp body, temperature sensor and power cord are connected before power on.
    ②, turn on the power switch. Wait for the self-test to pass before using (the panel display shows the set value from the last use).
③. There are two switches on the front panel to control the PCB pre-heat and the IR lamp body respectively; press "▲" and "▼" on the front panel "IR PRE-HEAT PIATE" to adjust the temperature of the PCB within 60-200°C. Press the switch "ON" to start the pre-heating chassis, press the switch "OFF" to stop the pre-heating chassis; press the switch "IR  Press "▲" and "▼" on the front panel "IR HEAT LAMP" to adjust the working temperature of the infrared lamp body within 200-350°C. Press the switch to "ON When the switch is "ON", the infrared lamp body starts working, when the switch is "OFF", the infrared lamp body stops working.
2. Operation of desoldering/reworking.
①, PCB board placement.
Align the selected PCB board with the slot on the pallet and place it on the PCB board holder, fasten the PCB board pallet hand wheel and fix the PCB board; move the pallet slider left and right to select a suitable working position.
②. Adjustment and preparation before desoldering/reworking.
Adjust the position of the PCB board so that the centre of the chip to be desoldered/reworked is vertically aligned with the spot centre of the IR lamp body; adjust the height of the lamp body to maintain a height of 20-30mm between the lamp head and the desoldered object.
Adjust the height of the infrared lamp temperature sensor to prevent the chip or chip near the appropriate location, in the chip around and the sensor head coated with flux (solder or solder oil), this can make the temperature measured by the sensor more accurate, while the flux flux flux role, BGA pads will be more intact, can effectively prevent the pads are stuck up and tin hair and other problems.
When the chip is coated with anti-water sealant, be sure to first turn on the infrared preheating chassis melt glue, so that the glue is heated and softened or powdered, first clean up; also available soluble glue water soluble glue and other measures. According to the manufacturer to provide the melting temperature, melt glue processing, melt glue temperature should not be too high, generally 120-140 ℃ is appropriate, preheating time of 3-5 minutes or longer.
③. Desoldering/reworking process.
Adjusting the preheating temperature of the PCB board (adjustable from 60-200°C) according to the process requirements of the product or the size of the PCB board. The preheating chassis can be opened in advance, generally for 3-5 minutes, and the preheating chassis will be stable within the preset temperature range.
According to the size of the chip and welding process requirements, select the appropriate heating temperature of the infrared lamp (200-350 ℃ adjustable), can meet the desoldering / rework process requirements can be.
The general experience is that the output temperature of the infrared lamp (adjustable from 200-350°C) and the PCB pre-heating temperature (adjustable from 60-200°C) are appropriately adjusted according to the size of the desoldering/reworking chip.
When desoldering/reworking chips smaller than 20x20mm, adjust the IR lamp temperature to 220-240°C. If the chip is not coated with waterproof sealant or the PCB board is small and will not be deformed, the preheating chassis can be left open to preheat; otherwise, it is appropriate to preheat to 100-120°C first.
When dismantling chips larger than 30x30mm, according to the process and user experience, the infrared lamp can be adjusted to about 240-260℃, preheat the chassis PCB board temperature to 120-140℃, preheat 3-5 minutes first, and after the chassis is stable at the preset temperature, it is easy to complete the desoldering/reworking process.
Infrared light heat can be adjusted steplessly, according to the size of the chip you choose to adjust freely, when adjusted to the maximum, infrared light is the strongest, the chip heats up faster, pay special attention to control to prevent the sensor from shifting, inaccurate temperature measurement, the chip heats up too long, heats up too high, heat bad chip.
The operation process of dismantling is generally as follows: fix the PCB board, adjust the position of the PCB board, adjust the centre of the infrared lamp to the dismantled chip, adjust the height of the infrared lamp, place the temperature sensor of the infrared lamp, apply flux, set the preheating temperature of the preheating chassis and the working temperature of the infrared lamp, open the preheating chassis, after 3-5 minutes or longer, the preheating temperature stabilises around the set value, open the infrared lamp to heat the chip After the chip has reached the preset temperature or the chip tin tray has melted, remove the chip with a vacuum pen or tweezers, switch off the infrared lamp and the preheating tray, wait for the host to cool down sufficiently, then switch off the power.
The operation process of back soldering is generally the same as the disassembly process. The differences are: clean up the pads and the solder balls, preheat the PCB, place the chips correctly, preheat the solder balls according to the process temperature, reflow soldering and cooling.
For lead-free devices the temperature can be increased by another 20-30°C.
Desoldering/reworking of all kinds of strips and pin sockets (e.g. CPU sockets and GAP sockets).
The general operation is: first to desoldering PCB board to be afraid of the heat of the part and not desoldering devices with aluminum foil cover, and then to desoldering PCB board fixed in PCB board bracket, fixed, preset PCB board preheating temperature to 160-180 ℃, the temperature sensor placed next to the desoldering devices, open the preheating chassis, after 3-5 minutes or longer, desoldering devices are evenly heated, generally can be desoldered. Specially, you can turn on the top infrared lamp to assist heating, you can quickly desolder the device.
For lead-free devices can then increase the temperature of 20-30 ℃ can be.
For double-sided boards, a lower preheating temperature can be used to preheat the PCB first, then supplemented by top heating.

⑤. Notes on the desoldering/reworking process and related instructions.
When desoldering/reworking chips of larger PCB boards, for example: computer boards, the whole board must be fully preheated and dried, either according to the process requirements provided by the manufacturer or by experience; only when handled properly can the deformation of the PCB board and the resulting dummy soldering and chip warping be effectively prevented when desoldering/reworking chips.
For simple packages, it is recommended that aluminium foil is pre-laminated to the centre of the chip (where the silicon is located) to prevent the silicon from overheating and bursting. The size of the foil should be slightly larger than the wafer, but not so large that it will affect the soldering effect.
During the desoldering/repair process, all plastic inserts in the area irradiated by the infrared light should be covered with aluminium foil to prevent deformation or damage from high temperature infrared baking. However, not all of them should be wrapped.
After the PCB has been rewelded/reworked, wait for it to cool down, clean and dry it first, then test it; if it does not work, you can reweld it again. If it does not work again repeat the whole process.
Before and after work, without pressing and placing the PCB board, do not turn on the infrared lamp for a long time, it will reduce the service life of the lamp; it is strictly forbidden to use the infrared lamp for a long time to irradiate reflective objects with strong reflectivity, which will seriously affect the life of the lamp.
3、Maintenance and overhaul.
①, the maintenance of the whole machine: after the machine has been used for a period of time, the sliding part of the focus frame, guide column, PCB board support, etc., is regularly wiped with grease to keep it slippery and anti-rust purpose.
②, preheating chassis and infrared lamp body maintenance: preheating chassis and infrared lamp body, especially the high permeability of the infrared lamp protective glass, regular wipe with anhydrous alcohol to remove flux condensate, in order to maintain the smooth infrared heat radiation.
③. Replacement of the infrared lamp: when replacing the infrared lamp, use special internal pliers or long-nosed pointed pliers, first remove the spring inner card that fixes the slide, the slide and the spring inner card at once; then remove the spring inner card that fixes the infrared lamp, then use a bamboo stick or wooden stick at the ventilation hole outside the lamp barrel to gently jack out the infrared lamp, pull out the lamp holder and replace it with a new infrared lamp; just put it on again in the opposite order.
Cautions.
   1、After work, do not turn off the power immediately so that the fan can fully cool the lamp body and prolong its service life.
   2. Keep the ventilation open and the lamp body clean. Clean the lamp head glass regularly with anhydrous alcohol!
   3, Guide column, focus bracket wipe with grease at appropriate times to maintain lubrication.
   4, Careful, high temperature operation, pay attention to safety.
   5, Long-term non-use, should unplug the power!

Main parameters.
Worktop size: 360X240mm
Rated voltage and frequency: AC220-230v 60/50Hz
Power of the whole machine: 1000W
Infrared light body power: 150W
Infrared preheating chassis power: 800W
Infrared lamp body heating size: Φ70mm(50x50mm)
Preheating chassis preheating size：240x180mm
Infrared lamp body temperature adjustable：200℃-350℃
Preheating chassis temperature adjustable：60℃-200℃