Heat Sink Compound are single component modified silicone system. This product finds versatile applications like mounting studs of transistors, diodes and silicone rectify to provide effective heat seal and to improve conductivity at heat sink junctions.

Features:

Suits All Transistors

Excellent Heat Dissipation Characteristics

It fills even minute air gaps between the mating surface & thereby reducing the thermal impedance.

This product is a thermally conductive but electrically insulating system.

It will not harden or dry out or melt even after ~1000 hours @ 200°C with good single component modified silicone system suitable for heat sink application.

Application:

This product finds application in mounting studs of transistors, diodes and silicone rectifiers to provide effective heat seal and to improve thermal conductivity at heat sink junctions