Study Of Thermal Interface Conductance Between Realistic Bolted Joints

Study Of Thermal Interface Conductance Between Realistic Bolted Joints

Sujana N.,Shashank T. N.

Autore: Sujana N.,Shashank T. N.
Formato: Copertina flessibile
Pagine: 56
Data Pubblicazione: 2021-03-18
Edizione: 1
Lingua: English

Descrizione:
Study of heat conductance plays a major role in spacecraft thermal design under vacuum environment. Since the space environment is found to be a vacuum, the convective heat transfer is absent. Hence the conduction plays an important role in heattransfer mechanism. The heat generated within spacecraft/satellites from an electronics box must flow through conducting medium to the box surface. This generated heat should either radiate or conduct to a heat sink. Conduction path includes number of joints in the box surface where heat must be transferred by contact between the surfaces. These joints include screws guides and bolts to attach circuit boards to an electronicsbox chassis in spacecraft shelf Hence the thermal conductaithof contacting surfaces is an important parameter for spacecraft thermal design. The objective of this work is to study the temperature variations and pressure distribution on too rectangular plates (Al 6061) of different thickness (10mm and 3mm). The plates were bought together and joined using M4 bolts, with the vacuum environment by varying the cold temperature and heater positions.