Frequency	2.7 GHz / 2700 MHz
Maximum turbo frequency	3.5 GHz / 3500 MHz
Bus speed	8 GT/s QPI (4000 MHz) 5 GT/s Direct Media Interface
Clock multiplier	27
Package	2011-land Flip-Chip Land Grid Array
Socket	Socket 2011 / LGA2011
Size	2.07" x 2.01" / 5.25cm x 5.1cm

Architecture / Microarchitecture
Instruction set	x86
Microarchitecture	Ivy Bridge
Platform	Romley-EP Romley-WS
Processor core	Ivy Bridge-EP
Core stepping	C0 C1
CPUIDs	306E4
Manufacturing process	0.022 micron
Data width	64 bit
The number of CPU cores	12
The number of threads	24
Floating Point Unit	Integrated
Level 1 cache size	12 x 32 KB instruction caches 12 x 32 KB data caches
Level 2 cache size	12 x 256 KB
Level 3 cache size	30 MB
Physical memory	768 GB (per socket)
Multiprocessing	Up to 2 processors
Extensions & Technologies	MMX instructions SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSSE3 / Supplemental Streaming SIMD Extensions 3 SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 AES / Advanced Encryption Standard instructions AVX / Advanced Vector Extensions F16C / 16-bit Floating-Point conversion instructions EM64T / Extended Memory 64 technology / Intel 64 VT-x / Virtualization technology VT-d / Virtualization for directed I/O TBT 2.0 / Turbo Boost technology 2.0 HT / Hyper-Threading technology
Security Features	NX / XD / Execute disable bit TXT / Trusted Execution technology
Low power features	Enhanced SpeedStep technology
Integrated Graphics Processing Unit
None
Integrated peripherals / components
Memory controller	The number of controllers: 1 Memory channels (per controller): 4 Memory channels (total): 4 Supported memory: DDR3-800, DDR3-1066, DDR3-1333, DDR3-1600, DDR3-1866 ECC supported: Yes
Other peripherals	Direct Media Interface 2.0 Quick Path Interconnect (2 links) PCI Express 3.0 interface
Electrical / Thermal parameters
V core	0.65V - 1.3V
Minimum/Maximum operating temperature	5°C - 86°C
Thermal Design Power	130 Watt

Package List ； 2Pcs  E5 2697 V2 CPU