Metal glaze on high quality ceramic
Protective over glaze
Excellent stability (ΔR/R ≤ 1 % for 1000h at 70 °C)
Lead (Pb)-free solder contacts on Ni barrier layer
Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering processes
| Resistance | Choose - Ω | |
| Package/Case | 0603 | |
| Tolerance | ±1% | |
| Power Rating | 0.1W | |
| Temperature Coefficient | ±100ppm/°C | |
| Technology | Thick Film | |
| Dimensions | 1.6 x 0.5mm | |
| Voltage rating | 75V | |
| Operating Temperature | -55 → 155°C | |
| Technology | Thick Film | |
| Series | CR0603 |