0.56mm 0.71mm 1.22mm High Melting Point Solder HMP 366 PbSnAg1.5% Silver 301°C

Sizes available from menu:-

Applications:- 

Making nearby soldered joints:

A useful application of a high melting point alloy is the soldering of joints close to each other in such a way that the first joint is not re-melted while the later joint, or joints, are being made.

The first joint is made with HMP alloy (296-301°C) and the further joints are made with successively lower melting point alloys, for example - 60/40 tin/lead alloy (183-188°C) and good control of soldering temperatures.

Service at high temperatures:

The maximum safe service temperature for any solder alloy subjected to stress is about 40°C below the solidus melting temperature, HMP alloy can therefore be relied upon in service up to about 255°C compared with about 145°C for the common tin/lead alloys.
HMP alloy is consequently particularly suitable for soldering electric motors, car radiators, high temperature lamps and other products which are likely to meet relatively high temperatures during their working life.
If HMP is used to solder tin/lead coated components, the resulting soldered joint will be a new alloy with a lower melting point than HMP alloy.

This will depend on the thickness and composition of the coating. The coating itself could therefore be HMP alloy if necessary.

Service at very low temperatures:

Tin/Lead alloys containing more than 20% of tin become brittle at temperatures below about -70°C.

The HMP alloy containing 5% of tin remains ductile (non-brittle) down to below -200°C.

Multicore HMP alloy is also recommended therefore for service in extremely cold conditions.