| General information |
| Type | CPU / Microprocessor |
| Market segment | Mobile |
| Family | AMD Mobile Sempron |
| Model number ? | 3000+ |
| CPU part number | SMS3000BQX2LF is an OEM/tray microprocessor |
| Stepping code | CBBWE |
| Frequency ? | 3000+ (rated)
1800 MHz (real) |
| Clock multiplier ? | 9 |
| Package | 754-pin lidless organic micro-PGA |
| AMD Package number | 27973 |
| Socket | Socket 754 |
| Introduction date | November 23, 2004 |
| Price at introduction | $134 |
| |
| Architecture / Microarchitecture |
| Microarchitecture | K8 |
| Processor core ? | Roma |
| Core stepping ? | DH-E6 |
| CPUID | 20FC2 |
| Manufacturing process | 0.09 micron |
| The number of cores | 1 |
| The number of threads | 1 |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 64 KB instruction cache
64 KB data cache |
| Level 2 cache size ? | 128 KB |
| Multiprocessing | Uniprocessor |
| Features | - MMX Technology
- 3DNow!
- SSE
- SSE2
- SSE3
- Enhanced Virus Protection ?
|
| Low power features | PowerNow! technology |
| On-chip peripherals | - Single-channel DDR SDRAM memory controller
- One 16-bit HyperTransport link with speeds up to 800 MHz
|
| |
| Electrical/Thermal parameters |
| V core ? | 1.2V |
| Maximum operating temperature ? | 95°C |
| Thermal Design Power ? | 25 Watt |