AMD FX 4100 CPU 3.6 GHz FD4100WMW4KGU Socket AM3+ Processor

Product Description

General information
Type CPU / Microprocessor
Market segment Desktop
Family
 
Model number  ?  FX-4100
CPU part numbers
 
  • FD4100WMW4KGU is an OEM/tray microprocessor
  • FD4100WMGUSBX is a boxed microprocessor with fan and heatsink
Frequency  ?  3600 MHz
Maximum turbo frequency
3700 MHz (more than 2 cores)
3800 MHz (2 cores or less)
Bus speed  ?  One 2600 MHz 16-bit HyperTransport link
Package
940-pin organic micro Pin Grid Array (UOC940)
Pb-free
Socket Socket AM3+
Size 1.57" x 1.57" / 4cm x 4cm
Weight
1.4oz / 38.8g (CPU)
1lb 4.4oz / 577.7g (box)
Fan/heatsink CKM-7X52A-A1-GP
Introduction date October 12, 2011
Price at introduction $115
Architecture / Microarchitecture
Microarchitecture Bulldozer
Platform Scorpius
Processor core  ?  Zambezi
Core stepping  ?  OR-B2
CPUID 600F12
Manufacturing process 0.032 micron Hi-K Metal Gate process with silicon-on-insulator (SOI) technology
Die 316mm2
Data width 64 bit
The number of CPU cores 4
The number of threads 4
Floating Point Unit Integrated (shared between each pair of cores)
Level 1 cache size  ? 
2 x 64 KB 2-way set associative shared instruction caches
4 x 16 KB 4-way set associative data caches
Level 2 cache size  ?  2 x 2 MB 16-way set associative shared exclusive caches
Level 3 cache size 8 MB 64-way set associative shared cache
Cache latency 3 (L1 cache)
Multiprocessing Uniprocessor
Features
  • MMX instructions
  • Extensions to MMX
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ? 
  • SSE4a  ? 
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • FMA4 / 4-operand Fused Multiply-Add instructions
  • XOP / eXtended Operations instructions
  • AMD64 / AMD 64-bit technology  ? 
  • AMD-V / AMD Virtualization technology
  • EVP / Enhanced Virus Protection  ? 
  • Turbo Core 2.0 technology
Low power features
  • Core C1, C1E, C6 and CC6 states
  • Package S3, S4 and S5 states
  • PowerNow!
Integrated peripherals / components
Integrated graphics None
Memory controller
The number of controllers: 1
Memory channels: 2
Channel width (bits): 72
Supported memory: DDR3-1866
DIMMs per channel: 2
Maximum memory bandwidth (GB/s): 29.9
Other peripherals HyperTransport 3.1 technology
Electrical / Thermal parameters
Maximum operating temperature  ?  70°C
Thermal Design Power  ?  95 Watt

Package Include：

1 * CPU.

In 100% working order. Photo above is only for illustration purposes. 
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The goods are sent from the CN&HK.

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