MoreFrom ebay Banner

MoreFrom Delivery Options
MoreFrom Contact Details
MoreFrom Brands banner
morefrom
Kingston 3GB 666MT/s DDR4 CL16 SODIMM (Kit of ) FURY Impact :: KF426S16IBK2/32 (Components > Memory RAM)
morefrom
morefrom
KF426S16IBK2%2f32
Images for illustration purposes only
morefrom
morefrom
The best way to get information on this product is to contact the manufacturer directly:
Please contact Kingston on 01932 738 888, visit the Kingston website www.kingston.com
morefrom
morefrom

Overview



Get your notebook or small form factor machine fully equipped with Kingston FURY??? Impact DDR4 SODIMM and minimize system lag. Ready for AMD Ryzen??? and Intel XMP-ready in capacities up to 64GB, Plug N Play FURY Impact DDR4 automatically overclocks to the highest frequency published, up to 3200MHz, to support Intel and AMD???s latest CPU technologies. Slot in the sleek black PCB for a hassle-free boost, no need to tinker with the BIOS. Upgrade your system???s performance and still run cool, quiet, and efficiently, thanks to FURY Impact DDR4???s low 1.2 voltage.

Powerful SODIMM Performance
Maximize your memory and get a boost to your gaming, multitasking, and rendering.

Plug N Play Automatic Overclocking Functionality
Impact DDR4 automatically overclocks itself to the highest published frequency.

Intel XMP-Ready Profiles
Our engineers have predefined Intel Extreme Memory Profiles designed to maximize the performance of our memory modules, reaching speeds up to 3200MHz.

Ready for AMD Ryzen
Get memory that???s ready for AMD Ryzen and will seamlessly integrate with your AMD-based SODIMM-compatible system. A reliable, compatible performance boost for your build.

Higher Performance with Low Power Consumption
Run your system cool and efficiently with Impact DDR4???s low 1.2V power draw.

Slim form, sleek design
The black PCB and sleek thermal label deliver big style with a small footprint.




At-a-glance



  • Higher Performance with Low Power Consumption

  • Intel XMP-Ready Profiles

  • Plug N Play Automatic Overclocking Functionality

  • Powerful SODIMM Performance

  • Ready for AMD Ryzen???

  • Slim form, sleek design





Reasons to buy


  • Higher Performance with Low Power Consumption
  • Intel XMP-Ready Profiles
  • Plug N Play Automatic Overclocking Functionality
  • Powerful SODIMM Performance
  • Ready for AMD Ryzen???
  • Slim form, sleek design

Specification


Features
JEDEC standard:
Yes
Linux operating systems supported:8 RT. Linux (9.4, 9.5), Red Hat Enterprise Linux 5.0 (supported with a pre-built package); SUSE Linux (10.3, 11.0, 11, 11.1, 11.2), Fedora (9, 9.0, 10, 10.0, 11.0, 11, 12, 12.0), Ubuntu (8.04, 8.04.1, 8.04.2, 8.10, 9.04, 9.10, 10.04), Debian (5.0, 5.0.1, 5.0.2, 5.0.3)
Yes
Windows operating systems supported:Windows vesions wich can be used with the device.
Yes
Backlight:Product has a built-in light source for its illuminating.
No
Cooling type:The method used to cool the device or to cool the air around the device.
Heatsink
Country of origin:Country where the device is made.
Taiwan
Programming power voltage (VPP):
2.5 V
Intel Extreme Memory Profile (XMP):
Yes
Row active time:
26.25 ns
Refresh row cycle time:
350 ns
Row cycle time:
45 ns
Module configuration:
2048M x 64
Memory voltage:The voltage (V) of the memory in the device.
1.2 V
Memory ranking:
1
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
16
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
No
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
260-pin SO-DIMM
Component for:What this product is used as a part of (component for).
Laptop
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
2666 MHz
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR4
Memory layout (modules x size):
2 x 16 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
32 GB
Buffered memory type:
Unregistered (unbuffered)

Logistics data
Harmonized System (HS) code:
84733020

Operational conditions
Storage temperature (T-T):The minimum and maximum temperatures at which the product can be safely stored.
-55 - 100 ??C
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
0 - 85 ??C

Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
30 mm
Width:The measurement or extent of something from side to side.
69.6 mm


morefrom
morefrom
morefrom
morefrom