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BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125℃±5℃ x 24 hours or 80℃±5℃ x 48 hours
Pay attention to the difference between leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips: 
245℃-260℃(Maximun)
Leaded/Pb BGA chips: 180℃-205℃(Maximun)
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