GC 10 Solder Paste

Henkel LOCTITE introduces GC 10 - this Game Changer is the first-ever temperature stable solder paste

Image of Henkel LOCTITE GC 10 Solder PasteIn what is a true market breakthrough, Henkel LOCTITE has developed the first-ever temperature stable solder paste. Henkel LOCTITE's GC 10 is stable at 26.5°C for one year and at temperatures of up to 40°C for one month. GC 10 provides benefits throughout the logistics and operations chain, while still offering unbeatable printability and reflow performance.

  • No refrigeration
  • Improved stability
  • Improved printing
  • Improved reflow

Video - Henkel LOCTITE GC 10

IMPROVED PRINTINGIMPROVED STABILITYIMPROVED REFLOWIMPROVED PASTE MANAGEMENT
Abandon time: 8-24 hoursOn-line stencil stability: 3 days at 80% RHExcellent coalescence for 0201, 01005, and 0.3 mm pitchSuperior on-line paste utilization
Stencil life: 16-72 hoursPaste stability: 12x over conventionalAfter 3 days at 80% RH, zero dewetting on long soakEliminates end-of-day paste scrapping
High yield paste volumes with lowest aspect ratioElevated temperature stability: 100x over conventionalMinimal hot slump at 182°CEliminates refrigerated warehouse storage
Industry leader in paste-transfer efficiencyImproved shipping logistics managementBest in class cosmetic appearance for Pb-free solder jointsEliminates cold pack, dry ice, and overnight shipping
  Exceptional wetting for long, hot reflow profiles 
ATTRIBUTESCURRENT TECHNOLOGYHENKEL LOCTITE GC 10
Regulatory complianceHalide/halogen freeZero halogens added
Particle size distributionType 3, 4Type 3, 4, 5
STORAGE
Performance stable at 26.5°C1 month1 year
Performance stable at 40°C
1 day
1 month
Performance stable at 50°C01 week
PROCESS
Abandon time1 - 4 hours8 - 24 hours
Soak temperature (reflow)
150°C - 180°C
150°C - 200°C
On-line paste utilization75%> 95%
Start-up time4 - 24 hours0 hours



In what is a true market breakthrough, Henkel has developed the first-ever temperature stable solder paste. LOCTITE GC 10 is stable at 26.5°C for one year and at temperatures of up to 40°C for one month, which provides benefits throughout the logistics and operations chain – from shipping/receiving to printing and reflow. The temperature stability of the material delivers exceptional performance attributes such as 24-hour abandon times, stabilized and consistent print transfer efficiency, expansion of the reflow process window, more than 95% on-line paste utilization and significant reductions in solder-related defects. All of these advantages combined result in higher yields and more cost-effective PCB assembly. www.soldergamechanger.com