In what is a true market breakthrough, Henkel LOCTITE has developed the first-ever temperature stable solder paste. Henkel LOCTITE's GC 10 is stable at 26.5°C for one year and at temperatures of up to 40°C for one month. GC 10 provides benefits throughout the logistics and operations chain, while still offering unbeatable printability and reflow performance.
Video - Henkel LOCTITE GC 10
IMPROVED PRINTING | IMPROVED STABILITY | IMPROVED REFLOW | IMPROVED PASTE MANAGEMENT |
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Abandon time: 8-24 hours | On-line stencil stability: 3 days at 80% RH | Excellent coalescence for 0201, 01005, and 0.3 mm pitch | Superior on-line paste utilization |
Stencil life: 16-72 hours | Paste stability: 12x over conventional | After 3 days at 80% RH, zero dewetting on long soak | Eliminates end-of-day paste scrapping |
High yield paste volumes with lowest aspect ratio | Elevated temperature stability: 100x over conventional | Minimal hot slump at 182°C | Eliminates refrigerated warehouse storage |
Industry leader in paste-transfer efficiency | Improved shipping logistics management | Best in class cosmetic appearance for Pb-free solder joints | Eliminates cold pack, dry ice, and overnight shipping |
Exceptional wetting for long, hot reflow profiles |
ATTRIBUTES | CURRENT TECHNOLOGY | HENKEL LOCTITE GC 10 |
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Regulatory compliance | Halide/halogen free | Zero halogens added |
Particle size distribution | Type 3, 4 | Type 3, 4, 5 |
STORAGE | ||
Performance stable at 26.5°C | 1 month | 1 year |
Performance stable at 40°C | 1 day | 1 month |
Performance stable at 50°C | 0 | 1 week |
PROCESS | ||
Abandon time | 1 - 4 hours | 8 - 24 hours |
Soak temperature (reflow) | 150°C - 180°C | 150°C - 200°C |
On-line paste utilization | 75% | > 95% |
Start-up time | 4 - 24 hours | 0 hours |