Genuine OEM HP HPE Hewlett Packard T630 TC Thin Client 4x 1052.761 MHz 4x 1024KB AMD Embedded G-Series GX-420GI Radeon R7E FP4 2.0 GHz Clockspeed 2.2 GHz Turbo Speed 16.1 W TDP Quad-Core 4 Cores Physical Modules Samsung 4GB RAM Memory DDR4 Dual Channel SDRAM 16GF 16GB MLC M.2 Storage Space Flash Drive WIFI/BT Wireless Bluetooth 19.5V 3.33A M40 v01.10 BIOS T7X70015 ThinPro 2GB x86_64 Operating System OS Image 4.15.7-hp Kernel Hi-Speed SuperSpeed Super Speed USB 2.0 3.0 VGA Analog Display Port DisplayPort 1.2 RJ45 RJ-45 Ethernet Ports 3.5mm Headphone Headset Jack PS/2 Keyboard Mouse USB USB-A 2.0 Optical Sensor Mouse Class 1 LED 5V 100mA Barrel Power Connector PC Computer 8C.5ADG2.ATA61BT 922347-001 3BG79UT 3BG79UT#ABA L12637-001 TPC-I020-TC 862947-024 MSIP-RMM-hpi-TPC-I020-TC 672652-001 674316-001 SM-2022

• Unused from opened box with some cosmetic / physical issues. (see pics)
• Tested and working. (see OS pic)
• Includes ThinClient t630, new SM-2022 mouse, and new base stand (see pics); does not include back plate, power supply, cords / cables, keyboard, docs, original packaging or box, etc.
• Has manufacturer plastic film on logo and some other exterior spots. (see pics)
• Exterior shows marks / scratches / blemishes from storage. (see pics)
• Heat sink has some damage and chipped paint spots. (see pic)
• A small piece from sliding cover broke off and is included in a plastic bag (see pic).
• Cover seems to be a bit janky - it's currently not sitting 100% flush - a bit loose in back and lock mechanism is not engaging. I think I just had issues getting the cover back on, as it sat flush originally with the lock working.
• Unsure if the included mouse was included in the original package or not.
• Mouse and base stand are new but may have minor cosmetic blemishes from storage.
• Repackaged well

Product image

Figure : HP t630 Thin Client

Processor/graphics

Feature	Description
AMD GX-420GI	2.2/2.0 GHz Cores: 4 TDP: 16.1W L2 cache: 2 MB
GPU: 626 MHz	Memory: DDR4

Memory

Feature	Description
Type	DDR4 dual channel SDRAM
Data transfer rate	Up to 1,866 MT/s
Peak transfer rate	14,933 MB/s
Number of slots	2 x SODIMM
Capacities	4 GB 8 GB 16 GB 32 GB NOTE:  WES 7E is a 32-bit operating system and only recognizes up to 3.2 GB RAM.
Reserved for graphics	256 MB, 512 MB (default), or 1 GB NOTE:  The system Graphics Processing Unit (GPU) uses part of the total system memory. System memory dedicated to graphics performance is not available for use by other programs.

Storage

Feature	Description
Type	NAND flash memory, non-volatile
Number of sockets	(2) M.2 designated as primary and secondary* Primary storage options No OS, Smart Zero and ThinPro: 8 GB, 16 GB, 32 GB, 64 GB, 128 GB WES 7E, 32bit: 16 GB, 32 GB, 64 GB, 128 GB Win 10 IoT, 64 bit: 32 GB, 64 GB, 128 GB NOTE:  *The primary socket supports M.2 flash up to size 2280 modules; the secondary socket accommodates up to size 2242 modules. The highest capacity offered in the secondary slot is 64 GB.
Capacities	Secondary storage options* All configurations: 8 GB, 16 GB, 32 GB, 64 GB WES 7E, 32bit restrictions for factory: The secondary drive must be equal to or greater than the capacity of the primary drive. NOTE:  *Secondary SSD capacity restrictions are for factory only. Secondary storage can be changed to any capacity desired after received from factory.
Flash memory	Multi-level Cell (MLC) Bits per cell: 2 Terabytes written (TBW)*: 5 TBW – 8GB, 10 TBW – 16GB, 20 TBW – 32GB Ultra MLC (UMLC) Bits per cell: 2 (only 1 is used) Terabytes written (TBW)*: 50 TBW – 16GB, 100 TBW – 32GB Triple-level Cell (TLC ) Bits per cell: 3 Terabytes written (TBW)*: 70 TBW - 128GB NOTE:  *Terabytes written (TBW) calculated based on JESD-219 SSD Client workload.

Input/output

Feature	Description
Keyboard	USB or PS/2
Mouse	USB or PS/2
Display/monitor	Number of displays supported: 2* (2) DisplayPort 1.2, 3840 x 2160 at 60 Hz** (1) VGA (optional), 1920 x 1200 at 60 Hz** NOTE:  *Adding the optional VGA output does not increase the number of displays supported. NOTE:  **The system should be configured with dual channel memory (two SODIMMs) for optimal display resolution performance. Dual channel memory (two SODIMMs) is required to achieve maximum resolution on dual UHD displays.
Ports and slots	(4) Hi-Speed USB 2.0 ports (2 front, 2 rear) (3) SuperSpeed USB 3.0 ports (2 front, 1 inside chassis) (2) DisplayPort 1.2 digital outputs (1) VGA analog output (optional)* (2) PS/2 keyboard/mouse ports (1) RJ45 network interface connector (1) Serial port, can be configured to produce 5V of power (1) 3.5 mm headset port (front) (1) 3.5 mm audio combo line-out/ line-in port (rear) NOTE:  *A single position at the back of the system is utilized for one of four optional outputs. One of the following can be configured to any system:   VGA video output   Second serial port   Fiber Optic NIC interface   External Wi-Fi antenna

Audio/video

Feature	Description
Audio subsystem	Internal amplified speaker system for basic audio playback 3.5 mm headset socket (front) 3.5 mm combo line-out/ line-in socket (rear)
Audio CODECs	MP3 AAC stereo HE AAC Includes hardware acceleration support
Video CODECs	MPEG-4 part 2 (DivX, Xvid) MPEG-4 part 10 (H.264, AVC) WMV 7/8/9 VC-1 and ASF Demuxer Includes hardware acceleration support

Hardware

Feature	Description
Security	Security lock slot (cable lock sold separately) Power cord retention clip Internal SuperSpeed USB 3.0 port Trusted Platform Module (version 1.2 or 2.0 depending upon the configured operating system)
Networking	Realtek Gigabit Ethernet (GbE), RJ45 connector access Wake on LAN (WOL) Preboot Execution Environment (PXE) TCP/IP with DNS and DHCP Secure Socket Tunneling Protocol (SSTP), supported with Windows OS

Wi-Fi networking

Feature	Description
Wi-Fi adapter options:	Intel Dual Band Wireless-AC 3168 Wi-Fi/Bluetooth combo adapter Intel Dual Band Wireless-AC 8260 Wi-Fi/Bluetooth combo adapter

NOTE: 

Wireless access point and internet access required. Availability of public wireless access points limited.

Fiber optic networking

Feature	Description
Fiber optic adapter option: Allied Telesis AT-27M2/SC Fiber Fast Ethernet network interface	Form factor: M.2 Connector: SC, compliant with IEC 61754-4 External Interface: Complies with IEEE 802.3 1000BASE-X operation Features: IEEE 802.1p priority encoding/tagging (QoS, CoS) IEEE 802.1q VLAN tagging IEEE 802.3x flow control Buffer/FIFO: 2K transmit and 2K receive Loopback mode Descriptor-based buffer management Wake-on-LAN from S3 (Sleep) and S4 (Hibernate) not supported Link Detection and PHY interface power (The PHY interface, Link detection, and Link LED are enabled by default at power up.) Performance: >= 85 Mbit/s receive, <= 30% CPU utilization >= 85 Mbit/s transmit, <= 30% CPU utilization >= 170 Mbit/s total bi-directional, <= 30% CPU utilization Power: Uses less than 1775 mW of power at full performance Supports all PCI Express bus states L0, L0s, L1, and L2 Non-volatile storage: The MAC address is unique for each system, assigned from the board assembly manufacturer IEEE registered allocation. The PCI subsystem ID is unique to HP and unique to each design to allow Windows Update to be finely controlled.
Fiber optic adapter option: Allied Telesis AT-29M2/SC or AT-29M2/LC fiber Gigabit network interface	Form factor: M.2 Connector: SC, compliant with IEC 61754-4 External Interface: Complies with IEEE 802.3 1000BASE-X operation Features: IEEE 802.1p priority encoding/tagging (QoS, CoS) IEEE 802.1q VLAN tagging IEEE 802.3x flow control Buffer/FIFO: 22K transmit and 40K receive Loopback mode Descriptor-based buffer management Wake-on-LAN from S3 (Sleep) and S4 (Hibernate) not supported Link Detection and PHY interface power (The PHY interface, Link detection, and Link LED are enabled by default at power up.) Performance: >= 800 Mbit/s receive, <= 30% CPU utilization >= 800 Mbit/s transmit, <= 30% CPU utilization >= 1500 Mbit/s total bi-directional, <= 30% CPU utilization NOTE:  The minimum transfer size at 1000 Mbit/s is 1500 Gbps. Power: Uses less than 2100 mW of power at full performance Supports all PCI Express bus states L0, L0s, L1, and L2 Non-volatile storage: The MAC address is unique for each system, assigned from the board assembly manufacturer IEEE registered allocation. The PCI subsystem ID is unique to HP and unique to each design to allow Windows Update to be finely controlled.

External power supply

Feature	Description
Power supply	65W external power adapter Worldwide auto-sensing 100-240 VAC, 50-60 Hz Energy-saving automatic power down Surge tolerant

NOTE: 

The dimensions of the power brick vary by supplier.

Physical specifications

Feature	Description
H x W x D: (vertical orientation)	25.1 x 12 x 22 cm (9.88 x 4.72 x 8.66 in) Without stand: 24 x 4.2 x 22 cm (9.45 x 1.65 x 8.66 in)
Volume	2.21 liters (74.73 fl oz)
System weight	1.52 kg (3.35 lb) Without stand: 1.45 kg (3.2 lb)

NOTE: 

All measurements are approximate; the addition of optional modules will increase the weight.

Operating system

Feature	Description
Operating systems	HP Smart Zero Core HP ThinPro Windows Embedded Standard 7E Windows 10 IoT Enterprise

Environmental specifications

Feature	Description
Operating temperature range	10° to 40° C (50° to 104° F) Using Quick Release with a flat panel monitor: 10° to 35° C (50° to 95° F)
Non-operating temperature range	-30° to 60° C (-22° to 140° F)
Humidity	Condensing: 20% to 80% Non-condensing: 10% to 90%

NOTE: 

Specifications are at sea level with altitude derating of 1° C/300m (33.8° F/984 ft) to a maximum of 3 km (9,842 ft), with no direct, sustained sunlight. Upper limit may be limited by the type and number of options installed.

Shipping

• Shipped securely using USPS
• Shipped within 1 business day after receiving payment
• Shipped weekdays only, excluding major Holidays
• Shipped to USA only

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Returns & Refunds

• Due to the nature of this listing, no returns will be accepted.

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