SK HYNIX
H26M31001FPR
Flash, 4GX8, PBGA153, IC MEMORY, PRE-BALLED
SPECIFICATIONS:
Mfr Package Description |
11.50 X 13 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, FBGA-153 |
JESD-30 Code |
R-PBGA-B153 |
Memory Density |
3.4359738368E10 bit |
Memory IC Type |
FLASH |
Memory Width |
8 |
Alternate Memory Width |
4.0 |
Number of Functions |
1 |
Number of Terminals |
153 |
Number of Words |
4.294967296E9 words |
Number of Words Code |
4G |
Operating Mode |
SYNCHRONOUS |
Operating Temperature-Min |
-25.0 Cel |
Operating Temperature-Max |
85.0Cel |
Organization |
4GX8 |
Package Body Material |
PLASTIC/EPOXY |
Package Code |
VFBGA |
Package Shape |
RECTANGULAR |
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Parallel/Serial |
PARALLEL |
Seated Height-Max |
0.8 mm |
Supply Voltage-Nom (Vsup) |
3.3 V |
Supply Voltage-Min (Vsup) |
2.7 V |
Supply Voltage-Max (Vsup) |
3.6 V |
Surface Mount |
YES |
Technology |
CMOS |
Temperature Grade |
OTHER |
Terminal Form |
BALL |
Terminal Pitch |
0.5 mm |
Terminal Position |
BOTTOM |
Length |
13.0 mm |
Width |
11.5 mm |