Mfr Package Description

11.50 X 13 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, FBGA-153

JESD-30 Code

R-PBGA-B153

Memory Density

3.4359738368E10 bit

Memory IC Type

FLASH

Memory Width

8

Alternate Memory Width

4.0

Number of Functions

1

Number of Terminals

153

Number of Words

4.294967296E9 words

Number of Words Code

4G

Operating Mode

SYNCHRONOUS

Operating Temperature-Min

-25.0 Cel

Operating Temperature-Max

85.0Cel

Organization

4GX8

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel/Serial

PARALLEL

Seated Height-Max

0.8 mm

Supply Voltage-Nom (Vsup)

3.3 V

Supply Voltage-Min (Vsup)

2.7 V

Supply Voltage-Max (Vsup)

3.6 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

OTHER

Terminal Form

BALL

Terminal Pitch

0.5 mm

Terminal Position

BOTTOM

Length

13.0 mm

Width

11.5 mm