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Descriptions:

Change the mirror pure copper shell to Intel CPU: temperature will drop about 9 degrees.
Has been passivated, will not be oxidized and corroded anymore.
Compatibility with LGA 115X CPU.
Using tip:
Recommended to use 704 or 922 adhesive for the cover (double-sided adhesive is not recommended), which can well bond the top cover and the substrate (prevent moving), and can also be used to fill in the small gap between the frame around the top cover and the substrate;The surface area of the top cover is slightly larger than the original one, which increases the contact area with the bottom of the radiator and increases its thermal conductivity. At the same time, the pure copper surface is also equivalent to removing the nickel plating layer on the original top cover surface (the heat conductivity of nickel is lower than that of copper), and the mirror treatment on the upper and lower surface of the top cover, which jointly increases the heat conductivity efficiency and achieves better heat conduction.

Note:

The Pure Copper Cover Suit for LGA 1150 interface CPU OR 6, 7, 8 generation LGA 1151 interface CPU,Please choose the suitable cover.
The 6 7 8 generations U cover thickness is not the same as the 3 4 generations
The front and back surface mirror polishing, can be used directly.

Specification:models for your selection: 6 7 8 generations

Packing includes:

Am 04.06.20 hat der Verkäufer die folgenden Angaben hinzugefügt:

Am 03.12.20 hat der Verkäufer die folgenden Angaben hinzugefügt: