The lead-free solder paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB.
Our pastes are made from environmentally-friendly flux and low oxidation spherical powders, which were characterized by long continuous repeatability printing time, high print definition, excellent solderability, and bright and smooth solder joint. Special formulation designs deliver excellent rheology and high viscosity retention ability even after extended open times. The wide reflow process window of our products is designed to minimize transition concerns from tin-lead to lead-free solder paste. With nearly transparent and no corrosion residue, our pastes gurantees high surface insulation resistance and offers high in-circuit pin test.
Function:
Flux type: NC-559-ASM
Volume: 10cc
Use:
phone repair,
PC BGA,
Welding and soldering electronics.