Product description:

NC-559-ASM BGA flux solder paste flux 100g flux
High-viscosity no-clean flux can be used for rework, fixing balls or pins to BGA, CGA and CSP packages and assembly operations.

For example, the flip chip is fixed on the PWB substrate, and the good formula of BGA ball/ball can make the ball adhere more.


Package list:

1 * Soldering paste

Note:

1. The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness.

2. Please allow slight manual measurement deviation for the data.

Payment must be completed within 5 days. If you have any problems about payment, please contact us via ebay message.

We only ship to confirmed ebay Order addresses. Please comfirm that your Order address is in line with your shipping address.

Please kindly note that the combined shipping is not provided because the shipping fee is calculated by weight. Also, the each additional item means exactly the the same color and size. 

It takes about 7-15 working days to Australia; about 10-30 working days to other countries. Transit time may be a little delayed because of the bad weather and customs inspection. If you do not receive your item within 30 working days since payment finished, please contact us immediately for further assistance.

We strive for 100% customer satisfaction! Positive Feedback is very important to us. If you have any questions, please feel free to contact us via "Ask seller a question" . We will reply your email within 24 working hours.