Description
Screen size 4.7 inches
Capacity 32 GB
Total number of USB ports 1
Brand Pioneer
Color Black
Accessories Micro USB cable (1.0 m) *for charging and data transfer
Manufacturer Pioneer
Manufacturer Model number XDP-300R(B)
Year of release 2016
Network Bluetooth
OS Android OS 5.1
Supported Audio Formats DSD(DSF/DSDIFF)/FLAC/ALAC/WAV/AIFF/Ogg Vorbis/MP3/AAC/MQA
Battery Included No
Product Size 1.3 x 7.59 x 12.89 cm; 200 g
Product Features Hi-Res Audio Support
Product height 12.89 cm
Product width 7.59 cm
Product depth 1.3 cm
Battery use No
Product weight 200 grams

Compatible with a variety of high-resolution audio sources. In addition, a 2.5 mm 4-pole balanced headphone output jack is provided for high-quality sound output.
The device supports a variety of playback formats used by popular high-resolution music distribution sites so that users can fully enjoy high-resolution sound sources. It supports DSD up to 11.2 MHz, FLAC up to 384 kHz / 24 bit, ALAC, WAV, AIFF, MQA, and other high-resolution formats. A wide range of sound sources can be reproduced with high sound quality. In addition, a 2.5 mm 4-pole balanced headphone output terminal is provided for high-quality sound output. It also supports 3.5 mm 3-pole headphone output, Micro USB-B / OTG digital output, and wireless playback, allowing users to enjoy high-quality sound with a variety of headphones and peripheral devices.

<Compatible audio formats

DSD (DSF/DSDIFF)/FLAC/ALAC/WAV/AIFF/MQA/OggVorbis/MP3/AAC

Ultra-high resolution playback. Equipped with two high-level DACs and two AMPs.
Equipped with two units each of ESS's ES9018K2M DAC and SABRE 9601K AMP, which are of a high standard for portable audio equipment. Component audio design realizes ideal symmetry in circuit design. By designing with the shortest and same distance wiring, it supports playback at ultra-high resolution and enables delicate balanced expression. Power consumption is also kept low.

Independent audio circuit design to minimize digital noise.
The audio section (DAC & AMP) and CPU section are completely separated in a "substrate separation structure inside the chassis. In addition, the switching power supply circuit and audio circuit are placed at a sufficient distance from each other, and the power supply configuration and wiring for each circuit and IC chip are thoroughly considered in the "closed-loop design. These circuit designs reduce digital noise to the utmost limit.