Weld Reworking Leaded Tin Beads 0.2~0.6mm BGA Reballing Ball IC Chip Rework
Size: 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6 mm
Item: Leaded BGA Reballing Ball
Suitable for IC Chip Rework
QTY:250K pcs / Bottle
Balls Alloy:Sn 63 / Pb 37
Feature:
1.Solder (Tin) paste is the best choice of reballing IC.
2.It is used instead of the pin in the IC component package structure.
3.Please Note: There are 250000Pcs/Bottle.The bigger the Reballing Balls, the more loaded it is.If it is a small Reballing balls,the product will only occupy a small space for the bottle.
Package Include:
250000pcs/bottle
Notice:
1.1cm=10mm=0.39inch.
2.Please allow 1-2mm error due to manual measurement and make sure you do not mind before ordering.
3.Please understand that colors may exist chromatic aberration as the different placement of pictures.
* Please make payment asap, then we can arrange shipment for you asap.
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*We will carefully test every item before shipment.The quality is guaranteed!
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* Hong Kong time : Monday to Saturday 8:30 am to 5:30 pm. * if you send email to us,In our working hours will be resumed within 24 hours. * If you we are not satisfied with us ,please contact me and don't give us negative or natural feedback,We must give you a satisfactory solution.
