BGA Reballing Balls Solder Ball Rework Repair Tools Leaded For IC Chip




 

Standard: RoHs Available & SGS Tested
It is used instead of the pin in the IC component package structure.
Solder (Tin) Balls is the best choice of reballing IC.
1 bottles BGA Reballing Balls (0.25mm,0.3mm,0.35mm,0.4mm,0.45mm,0.5mm,0.55mm,0.6mm,0.65mm) BGA Leaded Soldering Ball For Bga Repair Tools
Condition: Brand New
Quantity: 25,000 PCS per Bottle
Brand new and high quality.
Balls League: Sn63 / Pb37
Size: 0.25mm,0.3mm,0.35mm,0.4mm,0.45mm,0.5mm,0.55mm,0.6mm,0.65mm
Package Include:25000pcs/bottle
Notice:
1.1cm=10mm=0.39inch.
2.Please allow 1-2mm error due to manual measurement and make sure you do not mind before ordering.
3.Please understand that colors may exist chromatic aberration as the different placement of pictures.



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