Item Description
Features:
1. Using high efficient thixotropic agent, it can effectively prevent collapsing during printing and preheating, special soldering flux ensures good printing and fine patterns.
2. High-end quality, unique formula, perfect performance, easy to weld, solder joints bright and full, no false soldering, false soldering and other phenomena; residue colorless and transparent, does not affect the test, free of washing and cleaning performance is excellent.
3. The product is good wetting, dry resistance, at room temperature shelf life is relatively long, adapted to the cell phone repair industry, computer digital repair industry, high-precision circuit board SMT welding, BGA process welding and so on!
4. New technical support, unique chemical formula provides excellent wettability, to ensure high reliability. More advanced insulation technology, adhesion lasting, not easy to become dry, sticky time up to 48 hours or more.
5. Leaded solder paste features: cleaning-free, solid after welding, solder joints bright, not easy to connect the tin, good antioxidant properties, melting point 183 ℃ (Note: the melting point of the solder paste, that is, to reach the melting temperature, rather than welding when the temperature of the hot air gun adjustment) Push-type design, the flow of a smoother, flexible control of the amount of tin, to avoid waste. Applications: circuit boards, integrated circuits and other fields. Solder paste for electronics, BGA, IC soldering.
1. Using high efficient thixotropic agent, it can effectively prevent collapsing during printing and preheating, special soldering flux ensures good printing and fine patterns.
2. High-end quality, unique formula, perfect performance, easy to weld, solder joints bright and full, no false soldering, false soldering and other phenomena; residue colorless and transparent, does not affect the test, free of washing and cleaning performance is excellent.
3. The product is good wetting, dry resistance, at room temperature shelf life is relatively long, adapted to the cell phone repair industry, computer digital repair industry, high-precision circuit board SMT welding, BGA process welding and so on!
4. New technical support, unique chemical formula provides excellent wettability, to ensure high reliability. More advanced insulation technology, adhesion lasting, not easy to become dry, sticky time up to 48 hours or more.
5. Leaded solder paste features: cleaning-free, solid after welding, solder joints bright, not easy to connect the tin, good antioxidant properties, melting point 183 ℃ (Note: the melting point of the solder paste, that is, to reach the melting temperature, rather than welding when the temperature of the hot air gun adjustment) Push-type design, the flow of a smoother, flexible control of the amount of tin, to avoid waste. Applications: circuit boards, integrated circuits and other fields. Solder paste for electronics, BGA, IC soldering.
Specifications:
Name: Hong Kong maintenance man solder paste solder paste
Model: XG-Z40
Capacity: 10CC
Tin-lead ratio: 63SN/37PB
Product Weight: 35g
Name: Hong Kong maintenance man solder paste solder paste
Model: XG-Z40
Capacity: 10CC
Tin-lead ratio: 63SN/37PB
Product Weight: 35g
Package List:
Solder Paste*1
Booster*1
Solder Paste*1
Booster*1
Pinhole*1
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- If the item is defect when you receive it or you are not satisfied with it, please return it within 14 days for a replacement or money back. But the items must be back in factory condition. Please contact us and double check the return address before you return it.
- If is item is defective in 12 months, you can return it to us. We will send you a new replacement after receiving the defective item.