The product is a thermal compound called GC Electronics Z9 Heat Sink Compound. It is manufactured by GC and comes in a new, unopened package. The purpose of this product is to improve the thermal conductivity between a heat sink and a heat-generating component, such as a CPU or GPU, in order to dissipate heat more efficiently. It is commonly used in computer components and parts, as well as in fans, heat sinks, and cooling systems.