12th Generation LGA1700 AntiBending Buckle,Pressure Plate CPU Stress Bending
Features: Improved Cooling Efficiency:This support frame effectively corrects stress bending, ensuring better heat dissipation for LGA17XX BCFprocessor.
Efficient Heat Transfer:Crafted with excellent heat conductivity, this metal frame efficiently transfers heat from the processor to the cooling system, maintaining safe temperatures.
Suitable for Various Users:Whether you're a professional, casual user, this support frame is suitable for wide system, providing cooling performances.
Wide Usage Scenarios:From office tasks to multimedias editing, this support frame improve cooling performances, allowing your processor to handle demanding tasks.
Easy Installation:With its user friendly design, this support frame can be easily installed without leaving any mark, ensuring a clean and easy setups process.

Specifications: Material:Aluminum
Color:Black,
for LGA17XX BCFMotherboards
Size:Approx.70x54mm/2.76x2.13in

Package Includes: 1xCPU Contact Frame
1xL-Shaped Screw driver

note: Please allow 1-2cm errors due to manual measurement,please make sure that you donot mind befores you order.
Due to the differences between different monitors, the picture may not reflect the actual item color.