Product Specifications: Material: Tin+Solder Past Type: BGA Soldering Tin Cream Product: XG-Z40 Volume: 10ML Alloy: Sn63/Pb37 Design: Squeeze tube needle dispense Microns: 20-38u Application: Applicable to Phone PCB, BGA, SMD, PGA Repair Usage: PCB BGA Repairing Tool Function: Repair the Circuit Boards, Protect The Electronic Components Product Features： -Advanced insulation technology, a high viscosity no-clean flux, it can be used for PCB, SMD reworking, as well as reballing of computer and phone chips. -The mixture of high-quality alloyed powder and resinic pasty flux, which avoid the pale yellow residue, so you are easy to clean the board. Super compacity: Soldering paste for cell phone PCB, SMD, PGA and computer etc. Help to repair the circuit boards and protect the electronic components Flux Solder Paste - no clean soldering Syringe solder paste is an ideal assistant for phone motherboard and repairing cell phone surface mount assemblies. The syringe plunger will provide premium activity levels with maximum wetting and spreading, 10cc syringe is available for all rework soldering and desoldering repairs. High quality, perfect performance, easy to weld. Suitable for mobile phone repair industry, computer digital service industry, high-precision circuit board SMD welding, BGA welding technology and so on.

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Am 19.04.2024 hat der Verkäufer die folgenden Angaben hinzugefügt: