General information
Type	CPU / Microprocessor
Market segment	Server
Family	Intel Xeon E3-1200
Model number  ?	E3-1230
CPU part numbers	CM8062307262610 is an OEM/tray microprocessor BX80623E31230 is a boxed microprocessor
Frequency  ?	3200 MHz
Maximum turbo frequency	3600 MHz (1 core) 3500 MHz (2 cores) 3400 MHz (3 cores) 3300 MHz (4 cores)
Bus speed  ?	5 GT/s DMI
Clock multiplier  ?	32
Package	1155-land Flip-Chip Land Grid Array (FCLGA 1155)
Socket	Socket 1155 / H2 / LGA1155
Size	1.48" x 1.48" / 3.75cm x 3.75cm
Introduction date	Apr 3, 2011
End-of-Life date	Last order date is December 27, 2013 Last shipment date for tray processors is December 5, 2014
Price at introduction	$215
S-spec numbers
Part number ES/QS processors Production processors   Q1HQ SR00H BX80623E31230   + CM8062307262610 + +
Architecture / Microarchitecture
Microarchitecture	Sandy Bridge
Platform	Bromolow
Processor core  ?	Sandy Bridge
Core stepping  ?	D2 (Q1HQ, SR00H)
CPUID	206A7 (SR00H)
Manufacturing process	0.032 micron High-K metal gate process
Data width	64 bit
The number of CPU cores	4
The number of threads	8
Floating Point Unit	Integrated
Level 1 cache size  ?	4 x 32 KB 8-way set associative instruction caches 4 x 32 KB 8-way set associative data caches
Level 2 cache size  ?	4 x 256 KB 8-way set associative caches
Level 3 cache size	8 MB 16-way set associative shared cache
Physical memory	32 GB
Multiprocessing	Uniprocessor
Extensions and Technologies	MMX instructions SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSSE3 / Supplemental Streaming SIMD Extensions 3 SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ?  AES / Advanced Encryption Standard instructions AVX / Advanced Vector Extensions EM64T / Extended Memory 64 technology / Intel 64  ?  VT-x / Virtualization technology  ?  VT-d / Virtualization for directed I/O TBT 2.0 / Turbo Boost technology 2.0  ?  HT / Hyper-Threading technology  ?
Security Features	NX / XD / Execute disable bit  ?  TXT / Trusted Execution technology
Low power features	C1, C3 and C6 thread states C1/C1E, C3 and C6 core states C1/C1E, C3 and C6 package states Enhanced SpeedStep technology  ?
Integrated peripherals / components
Integrated graphics	None
Memory controller	The number of controllers: 1 Memory channels: 2 Supported memory: DDR3-1066, DDR3-1333 Maximum memory bandwidth (GB/s): 21.3 ECC supported: Yes
Other peripherals	Direct Media Interface 2.0 PCI Express 2.0 interface
Electrical / Thermal parameters
Minimum/Maximum operating temperature  ?	5°C - 69.1°C
Minimum power dissipation	5.5 Watt (C6 state)
Thermal Design Power  ?	80 Watt

Package Include：

1 * CPU.