3X(4PCS Universal BGA Stencil for MTK CPU RAM PM IC Reball Pin Direct Heat Templ
3X( and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed when you are proficient.
Simple and convenient to use.

Item Type: BGA Reballing Stencil
Colour: silver
Material: stainless steel

Package Contents:
4 x BGA Reballing Stencils)